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PDF BUK1M200-50SDLD Data sheet ( Hoja de datos )
| Número de pieza | BUK1M200-50SDLD | |
| Descripción | Quad channel TOPFET | |
| Fabricantes | NXP Semiconductors | |
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BUK1M200-50SDLD
Quad channel TOPFET™
Rev. 01 — 02 April 2003
Product data
1. Product profile
1.1 Description
Quad temperature and overload protected logic level power MOSFET in TOPFET™
technology in a 20-pin surface mount plastic package.
Product availability:
BUK1M200-50SDLD in SOT163-1 (SO20).
1.2 Features
s Power TrenchMOS™
s 5 V logic compatible input level
s Overtemperature protection
s Current limiting
s Overload protection
s ESD protection for all pins
s Input-source voltage resets latched s Overfatigue clamping for turn off of
protection circuitry.
inductive loads
s Input used to control output stage and s Low operating input current permits
supply overload protection circuits
direct drive by micro-controller.
1.3 Applications
s Low-side driver
s Low frequency Pulse Width
Modulation
s DC switching
s General purpose switch for driving
lamps, motors, solenoids and heaters.
1.4 Quick reference data
Table 1:
Symbol
RDSon
Ptot
Tj
VDS
Quick reference data
Parameter
drain-source on-state resistance
total power dissipation
junction temperature
drain-source voltage
[1] All devices active
Min
-
[1] -
-
-
Max Unit
200 mΩ
9.4 W
150 °C
50 V
1 page  
Philips Semiconductors
BUK1M200-50SDLD
Quad channel TOPFET™
120
Pder
(%)
80
03aa17
40
0
0 50 100 150 200
Tsp (°C)
Pder
=
-------P----t--o---t-------
P
×
100%
t o t ( 25 °C )
Fig 4. Normalized total power dissipation as a function of solder point temperature.
5. Thermal characteristics
Table 4:
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to mounted on thermo clad board
solder point.
one device active
all devices active
Min Typ Max Unit
- - 45 K/W
- - 13.3 K/W
9397 750 10956
Product data
Rev. 01 — 02 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
5 of 14
5 Page 
Philips Semiconductors
BUK1M200-50SDLD
Quad channel TOPFET™
8. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
y
Z
20
D
c
11
EA
X
HE v M A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A3)
A
Lp
L
detail X
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1 A2 A3 bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
w y Z (1)
0.25 0.1
0.9
0.4
0.01
0.004
0.035
0.016
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT163-1
IEC
075E04
REFERENCES
JEDEC
EIAJ
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
Fig 21. SOT163-1.
9397 750 10956
Product data
Rev. 01 — 02 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
11 of 14
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| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet BUK1M200-50SDLD.PDF ] | |
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