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PDF BULD25 Data sheet ( Hoja de datos )

Número de pieza BULD25
Descripción NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
Fabricantes Power Innovations Limited 
Logotipo Power Innovations Limited Logotipo



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No Preview Available ! BULD25 Hoja de datos, Descripción, Manual

Copyright © 1997, Power Innovations Limited, UK
BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
JULY 1994 - REVISED SEPTEMBER 1997
q Designed Specifically for High Frequency
Electronic Ballasts
q Integrated Fast trr Anti-parallel Diode,
Enhancing Reliability
q Diode trr Typically 500 ns
q New Ultra Low-Height SOIC Power Package
q Tightly Controlled Transistor Storage Times
q Voltage Matched Integrated Transistor and
Diode
q Characteristics Optimised for Cool Running
q Diode-Transistor Charge Coupling
Minimised to Enhance Frequency Stability
q Custom Switching Selections Available
q Surface Mount and Through-Hole Options
PACKAGE
Small-outline
Small-outline taped
and reeled
Single-in-line
PART # SUFFIX
D
DR
SL
D PACKAGE
(TOP VIEW)
B1
NC 2
NC 3
E4
8C
7C
6C
5C
NC - No internal connection
SL PACKAGE
(TOP VIEW)
B1
C2
E3
device symbol
C
description
B
The new BULDxx range of transistors have been
designed specifically for use in High Frequency
Electronic Ballasts (HFEB’s). This range of
E
switching transistors has tightly controlled
storage times and an integrated fast trr anti-parallel diode. The revolutionary design ensures that the diode
has both fast forward and reverse recovery times, achieving the same performance as a discrete anti-parallel
diode plus transistor.
The integrated diode has minimal charge coupling with the transistor, increasing frequency stability,
especially in lower power circuits where the circulating currents are low. By design, this new device offers a
voltage matched integrated transistor and anti-parallel diode.
This device is available in the now well established 8 pin low height surface mount D package, and the TO-
220 pin compatible SL package. Use of the SL package allows for a 40% height saving, making it ideal for
compact ballast applications.
absolute maximum ratings at 25°C ambient temperature (unless otherwise noted)
Collector-emitter voltage (VBE = 0)
Collector-base voltage (IE = 0)
Collector-emitter voltage (IB = 0)
Emitter-base voltage
RATING
SYMBOL
VCES
VCBO
VCEO
VEBO
VALUE
600
600
400
9
UNIT
V
V
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
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BULD25 pdf
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BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
JULY 1994 - REVISED SEPTEMBER 1997
THERMAL INFORMATION
THERMAL RESPONSE JUNCTION TO AMBIENT
vs
POWER PULSE DURATION
LDX25DZA
BULD25D
TA = 25°C
0·01
0%
0·001
10-4
10-3
duty cycle = t1/t2
Read time at end of t1,
t1
t2
TJ (max)
TA
=
PD (peak)
RZθθJJAA
RθJA (max)
10-2
10-1
100
101
102
103
t1 - Power Pulse Duration - s
Figure 8.
1·0
60%
40%
20%
10%
0·1
THERMAL RESPONSE JUNCTION TO AMBIENT
vs
POWER PULSE DURATION
LDX25SZA
BULD25SL
TA = 25°C
0·01
0%
0·001
10-4
10-3
duty cycle = t1/t2
Read time at end of t1,
t1
t2
TJ (max)
TA
=
PD (peak)
RZθθJJAA
RθJA (max)
10-2
10-1
100
101
102
103
t1 - Power Pulse Duration - s
Figure 9.
PRODUCT INFORMATION
5

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BULD25 arduino
D008
tape dimensions
BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
MECHANICAL DATA
JULY 1994 - REVISED SEPTEMBER 1997
D008 Package (8 pin SOIC) Single-Sprocket Tape
4,10 1,60
3,90 1,50
8,05 2,05
7,95 1,95
0,8 MIN.
0,40
5,55
5,45 12,30
11,70
6,50
6,30 ø 1,5 MIN.
0 MIN.
Cover
Tape
Carrier Tape
Embossment
Direction of Feed
2,2
2,0
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTES: A. Taped devices are supplied on a reel of the following dimensions:-
Reel diameter:
Reel hub diameter:
Reel axial hole:
330 +0,0/-4,0 mm
100 ±2,0 mm
13,0 ±0,2 mm
B. 2500 devices are on a reel.
MDXXAT
PRODUCT INFORMATION
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