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PDF BSP450 Data sheet ( Hoja de datos )
| Número de pieza | BSP450 | |
| Descripción | MiniPROFET (High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis) | |
| Fabricantes | Siemens Semiconductor Group | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BSP450 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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MiniPROFET
• High-side switch
• Short-circuit protection
• Input protection
• Overtemperature protection with hysteresis
• Overload protection
• Overvoltage protection
• Switching inductive load
• Clamp of negative output voltage with inductive loads
• Undervoltage shutdown
• Maximum current internally limited
• Electrostatic discharge (ESD) protection
• Reverse battery protection1)
Package: SOT 223
Type
BSP 450
Ordering code
Q67000-S266
Mini PROFET® BSP 450
4
3
2
1
Pins
1
OUT
2
GND
3
IN
4
Vbb
Maximum Ratings
Parameter
Supply voltage range
Load current
self-limited
Maximum input voltage2)
Maximum input current
Inductive load switch-off energy dissipation
single pulse
IL = 0.5A , TA = 85°C
Operating temperature range
Storage temperature range
Max. power dissipation (DC)3)
TA = 25 °C
Electrostatic discharge capability (ESD)4)
Symbol
Vbb
IL
VIN
IIN
EAS
Values
-0.3...48
IL(SC)
-5.0...Vbb
±5
0.5
Unit
V
A
V
mA
J
Tj
Tstg
Ptot
VESD
-40 ...+125
-55 ...+150
1.4
±1
°C
W
kV
Thermal resistance
chip - soldering point: RthJS
chip - ambient3) RthJA
7 K/W
70
ESD-
Diode
3 IN Rin
Voltage
source
V Logic
Voltage
sensor
Overvoltage Current
Gate
protection
limit protection
+ Vbb 4
Charge pump
Level shifter
Rectifier
Limit for
unclamped
ind. loads
OUT
Temperature
sensor
1
ESD Logic
Load
GND
2
Signal GND
MINI-PROFET
Load GND
1) With resistor RGND=150 Ω in GND connection, resistor in series with IN connections reverse load current
limited by connected load.
2)
3)
4)
At VIN > Vbb, the input current is
BSP 450 on epoxy pcb 40 mm x
not allowed to exceed
40 mm x 1.5 mm with
±5 mA.
6 cm2 copper
HBM according to MIL-STD 883D, Methode 3015.7
area
for
Vbb
connection
Semiconductor Group
1
06.96
1 page  
Typ. overload current
IL(lim) = f (t), Vbb=24V, no heatsink, Param.:Tjstart
IL(lim) [A]
1.6
Typ. operating current
IGND = f (Tj), Vbb=30V, VIN=high
GND [mA]
1
1.4
0.8
1.2
1
0.6
0.8
0.6
125°C
-25°C
0.4
0.4
0.2
0.2
0
-20 0 20 40 60 80 100
0
-25 0 25 50 75
t [ms]
BSP 450
100 125
Tj [°C]
Short circuit current
IL(SC) = f (Tj);Vbb = 30 V;
IL(SC) [Α]
1.6
Typ. standby current
Ibb(off) = f(Tj); Vbb = 30 V, VIN = low
Ibb(off) [µA]
7
1.4 6
1.2
5
1
4
0.8
3
0.6
2
0.4
0.2 1
00
-25 0 25 50 75 100 125
-25 0 25 50 75 100 125 150
Tj [°C]
Tj [°C]
Semiconductor Group
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet BSP450.PDF ] | |
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