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BSP450 데이터시트 PDF




Infineon Technologies AG에서 제조한 전자 부품 BSP450은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 BSP450 자료 제공

부품번호 BSP450 기능
기능 MiniPROFET(High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)
제조업체 Infineon Technologies AG
로고 Infineon Technologies AG 로고


BSP450 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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BSP450 데이터시트, 핀배열, 회로
MiniPROFET
High-side switch
Short-circuit protection
Input protection
Overtemperature protection with hysteresis
Overload protection
Overvoltage protection
Switching inductive load
Clamp of negative output voltage with inductive loads
Undervoltage shutdown
Maximum current internally limited
Electrostatic discharge (ESD) protection
Reverse battery protection1)
Package: SOT 223
Type
BSP 450
Ordering code
Q67000-S266
Mini PROFET® BSP 450
4
3
2
1
Pins
1
OUT
2
GND
3
IN
4
Vbb
Maximum Ratings
Parameter
Supply voltage range
Load current
self-limited
Maximum input voltage2)
Maximum input current
Inductive load switch-off energy dissipation
single pulse
IL = 0.5A , TA = 85°C
Operating temperature range
Storage temperature range
Max. power dissipation (DC)3)
TA = 25 °C
Electrostatic discharge capability (ESD)4)
Symbol
Vbb
IL
VIN
IIN
EAS
Values
-0.3...48
IL(SC)
-5.0...Vbb
±5
0.5
Unit
V
A
V
mA
J
Tj
Tstg
Ptot
VESD
-40 ...+125
-55 ...+150
1.4
±1
°C
W
kV
Thermal resistance
chip - soldering point: RthJS
chip - ambient3) RthJA
7 K/W
70
ESD-
Diode
3 IN Rin
Voltage
source
V Logic
Voltage
sensor
ESD
Logic
Overvoltage
protection
Current
limit
Gate
protection
+ Vbb 4
Charge pump
Level shifter
Rectifier
Limit for
unclamped
ind. loads
OUT
Temperature
1
sensor
Load
GND
2
Signal GND
MINI-PROFET
Load GND
1) With resistor RGND=150 in GND connection, resistor in series with IN connections reverse load current
limited by connected load.
2)
3)
4)
At VIN > Vbb, the input current
BSP 450 on epoxy pcb 40 mm
is
x
not allowed to exceed ±5 mA.
40 mm x 1.5 mm with 6 cm 2 copper
HBM according to MIL-STD 883D, Methode 3015.7
area
for
Vbb
connection
Semiconductor Group
Page 1 of 7
20.06.96




BSP450 pdf, 반도체, 판매, 대치품
Max allowable power dissipation
Ptot = f (TA,TSP)
Ptot [W]
16
14
12
1 0 TS P
8
6
4
TA
2
0
0 25 50 75
Current limit characteristic
IL(SC) = f (Von) (Von see testcircuit)
IL(SC) [A]
3.5
BSP 450
3
2.5
2
125°C
1.5
25°C
-25°C
1
0.5
100 125
TA, TSP[°C]
0
0
5 10 15 20 25
Von [V]
On state resistance (Vbb-pin to OUT pin)
RON = f (Tj);Vbb = 24 V;IL = 0.5 A
RON []
0.4
Typ. input current
IIN = f(VIN); Vbb = 24 V
IIN [µA]
90
0.35
0.3
0.25
0.2
0.15
0.1
0.05
98%
80
70
60
50
40
30
20
10
-25°C
25°C
125°C
0
-50
-25
0
25 50 75 100 125
0
0
Tj [°C]
5 10 15 20 25
VIN [V]
Semiconductor Group
Page 4
20.06.96

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BSP450 전자부품, 판매, 대치품
Package:
all dimensions in mm.
SOT 223/4:
BSP 450
Edition 7.97
Published by Siemens AG,
Bereich Halbleiter Vetrieb,
Werbung, Balanstraße 73,
81541 München
© Siemens AG 1997
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for
applications, processes and circuits implemented within components or assemblies.
The information describes a type of component and shall not be considered as warranted characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or
the Siemens Companies and Representatives worldwide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice
you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or
systems2 with the express written approval of the Semiconductor Group of Siemens AG.
1) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that
device or system.
2) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain and/or protecf human life. If they fail, it is reasonable to assume that the health of the user or
other persons may be endangered.
Semiconductor Group
Page 7
20.06.96

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관련 데이터시트

부품번호상세설명 및 기능제조사
BSP450

MiniPROFET (High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)

Siemens Semiconductor Group
Siemens Semiconductor Group
BSP450

MiniPROFET(High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)

Infineon Technologies AG
Infineon Technologies AG

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