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Número de pieza | BT134W-500 | |
Descripción | Triacs | |
Fabricantes | NXP Semiconductors | |
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No Preview Available ! Philips Semiconductors
Triacs
Product specification
BT134W series
GENERAL DESCRIPTION
Glass passivated triacs in a plastic
envelope suitable for surface
mounting, intended for use in
applications
requiring
high
bidirectional transient and blocking
voltage capability and high thermal
cycling performance. Typical
applications include motor control,
industrial and domestic lighting,
heating and static switching.
QUICK REFERENCE DATA
SYMBOL PARAMETER
MAX. MAX. MAX. UNIT
VDRM
IT(RMS)
ITSM
BT134W-
BT134W-
BT134W-
Repetitive peak off-state
voltages
RMS on-state current
Non-repetitive peak on-state
current
500
500F
500G
500
1
10
600
600F
600G
600
1
10
800
800F
800G
800
1
10
V
A
A
PINNING - SOT223
PIN DESCRIPTION
1 main terminal 1
2 main terminal 2
3 gate
tab main terminal 2
PIN CONFIGURATION
4
123
SYMBOL
T2
T1
G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
VDRM
IT(RMS)
ITSM
I2t
dIT/dt
IGM
VGM
PGM
PG(AV)
Tstg
Tj
Repetitive peak off-state
voltages
RMS on-state current
Non-repetitive peak
on-state current
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
Storage temperature
Operating junction
temperature
full sine wave; Tsp ≤ 108 ˚C
full sine wave; Tj = 25 ˚C prior to
surge
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 1.5 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
T2+ G+
T2+ G-
T2- G-
T2- G+
over any 20 ms period
-
-
-
-
-
-
-
-
-
-
-
-
-
-40
-
-500
5001
MAX.
-600
6001
1
10
11
0.5
50
50
50
10
2
5
5
0.5
150
125
-800
800
UNIT
V
A
A
A
A2s
A/µs
A/µs
A/µs
A/µs
A
V
W
W
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/µs.
September 1997
1
Rev 1.200
1 page Philips Semiconductors
Triacs
Product specification
BT134W series
MOUNTING INSTRUCTIONS
1.5
min
3.8
min
Dimensions in mm.
1.5
min
(3x)
1.5
min
2.3
4.6
6.3
Fig.13. soldering pattern for surface mounting SOT223.
PRINTED CIRCUIT BOARD
36
60
4.6
9
10
18
4.5
Dimensions in mm.
7
15
50
Fig.14. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick).
September 1997
5
Rev 1.200
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet BT134W-500.PDF ] |
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