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PDF BR211SM Data sheet ( Hoja de datos )
| Número de pieza | BR211SM | |
| Descripción | Breakover diodes | |
| Fabricantes | NXP Semiconductors | |
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Philips Semiconductors
Breakover diodes
Preliminary specification
BR211SM series
GENERAL DESCRIPTION
A range of bidirectional, breakover
diodes in a two terminal, surface
mounting, plastic envelope. These
devices feature controlled breakover
voltage and high holding current
together with high peak current
handling capability. Typical
application is transient overvoltage
protection in telecommunications
equipment.
OUTLINE - SOD106
QUICK REFERENCE DATA
SYMBOL PARAMETER
V(BO)
IH
ITSM
BR211SM-140 to BR211SM-280
Breakover voltage
Holding current
Non-repetitive peak current
MIN.
140
150
-
SYMBOL
MAX. UNIT
280 V
- mA
40 A
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
VD Continuous voltage
ITSM1
ITSM2
I2t
dIT/dt
Ptot
PTM
Tstg
Ta
Tvj
Non repetitive peak current
Non repetitive on-state current
I2t for fusing
Rate of rise of on-state current
after V(BO) turn-on
Continuous dissipation
Peak dissipation
Storage temperature
Operating ambient temperature
Overload junction temperature
10/320 µs impulse equivalent to
10/700 µs, 1.6 kV voltage impulse
(CCITT K17)
half sine wave; t = 10 ms;
Tj = 70 ˚C prior to surge
tp = 10 ms
tp = 10 µs
Ta = 25˚C
tp = 1 ms; Ta = 25˚C
off-state
on-state
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
Rth j-sp
Rth j-a
Zth j-a
Thermal resistance junction to
solder point
Thermal resistance junction to
ambient
Thermal impedance junction to
ambient
pcb mounted; minimum footprint
tp = 1 ms
MIN.
-
-
-
-
-
-
-
- 40
-
-
MAX.
75% of
V(BO)typ
40
UNIT
V
A
15 A
1.1 A2s
50 A/µs
1.2 W
50 W
150 ˚C
70 ˚C
150 ˚C
MIN. TYP. MAX. UNIT
- - 12 K/W
- 100 - K/W
- 2.62 - K/W
August 1996
1
Rev 1.100
1 page  
Philips Semiconductors
Breakover diodes
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.2 g
2.3
2.0
0.05
5.5
5.1
4.5
4.3
3.3
2.7
Preliminary specification
BR211SM series
0.2
2.8 1.6
2.4 1.4
Fig.11. SOD106.
Notes
1. For mounting and soldering instructions refer to publication SC18 "SMD Footprint Design and Soldering
Guidelines". Order code:9397 750 00505.
August 1996
5
Rev 1.100
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet BR211SM.PDF ] | |
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