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PDF BS616LV8022 Data sheet ( Hoja de datos )
| Número de pieza | BS616LV8022 | |
| Descripción | Very Low Power/Voltage CMOS SRAM 512K x 16 or 1M x 8 bit switchable | |
| Fabricantes | Brilliance Semiconductor | |
| Logotipo |  |
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BSI Very Low Power/Voltage CMOS SRAM
512K x 16 or 1M x 8 bit switchable
BS616LV8022
FEATURES
• Very low operation voltage : 2.4 ~ 5.5V
• Very low power consumption :
Vcc = 3.0V C-grade: 20mA (Max.) operating current
I-grade : 25mA (Max.) operating current
0.5uA (Typ.) CMOS standby current
Vcc = 5.0V C-grade: 45mA (Max.) operating current
I-grade : 50mA (Max.) operating current
3uA (Typ.) CMOS standby current
• High speed access time :
-70 70ns (Max.) at Vcc= 3.0V
-10 100ns (Max.) at Vcc= 3.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE1, CE2 and OE options
• I/O Configuration x8/x16 selectable by CIO, LB and UB pin
PRODUCT FAMILY
DESCRIPTION
The BS616LV8022 is a high performance, very low power CMOS Static
Random Access Memory organized as 524,288 words by 16 bits or
1,048,576 bytes by 8 bits selectable by CIO pin and operates from a wide
range of 2.4V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.5uA and maximum access time of 70/100ns in 3.0V operation.
Easy memory expansion is provided by an active HIGH chip
enable2(CE2), active LOW chip enable1(CE1), active LOW output
enable(OE) and three-state output drivers.
The BS616LV8022 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616LV8022 is available in 48-pin BGA type.
PRODUCT
FAMILY
OPERATING
TEMPERATURE
Vcc
RANGE
SPEED
(ns)
Vcc=3.0V
POWER DISSIPATION
STANDBY
Operating
(ICCSB1, Max)
(ICC, Max)
Vcc=3V Vcc=5V Vcc=3V Vcc=5V
PKG TYPE
BS616LV8022BC +0OC to +70OC 2.4V ~ 5.5V 70 / 100 3uA 30uA 20mA 45mA
BGA-48-0810
BS616LV8022BI -40OC to +85OC 2.4V ~ 5.5V 70 / 100 6uA 100uA 25mA 50mA
BGA-48-0810
PIN CONFIGURATIONS
BLOCK DIAGRAM
123456
A LB OE A0 A1 A2 CE2
B D8 UB A3 A4 CE1 D0
C D9 D10 A5 A6 D1 D2
D VSS D11 A17 A7 D3 VCC
E VCC D12 VSS A16 D4 VSS
F D14 D13 A14 A15 D5 D6
G D15 CI.O A12 A13 WE D7
H A18 A8 A9 A10 A11 SAE.
48-Ball CSP top View
A15
A14
A13
A12
A11
A10
A9
A8
A17
A7
A6
D0
.
.
.
.
D15
Address
Input
Buffer
22
Row
2048
Decoder
16(8)
.
.
. 16(8)
.
Data
Input
Buffer
16(8)
16(8)
Data
Output
Buffer
Memory Array
2048 x 4096
4096
Column I/O
Write Driver
Sense Amp
256(512)
Column Decoder
CE1
CE2
WE
OE
UB
LB
CIO
Vdd
Vss
Control
16(18)
Address Input Buffer
A16 A0 A1 A2 A3 A4 A5 A18 (SAE)
Brilliance Semiconductor Inc. reserves the right to modify document contents without notice.
R0201-BS616LV8022
1
Revision 2.4
April 2002
1 page  
BSI
DATA RETENTION CHARACTERISTICS ( TA = 0oC to +70oC )
SYMBOL
PARAMETER
TEST CONDITIONS
VDR Vcc for Data Retention
CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V;
VIN Њ Vcc - 0.2V or VIN Љ 0.2V
ICCDR
Data Retention Current
tCDR
Chip Deselect to Data
Retention Time
tR Operation Recovery Time
1. Vcc = 1.5V, TA = + 25OC
2. tRC = Read Cycle Time
CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V
VIN Њ Vcc - 0.2V or VIN Љ 0.2V
See Retention Waveform
BS616LV8022
MIN. TYP. (1) MAX.
1.5 --
--
UNITS
V
-- 0.2
0
TRC (2)
--
--
2
--
--
uA
ns
ns
LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled )
Vcc
CE1
Vcc
t CDR
VIH
Data Retention Mode
VDR Њ 1.5V
CE1 Њ Vcc - 0.2V
Vcc
tR
VIH
LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled )
Vcc
CE2
Vcc
t CDR
VIL
Data Retention Mode
VDR Њ 1.5V
CE2 Љ 0.2V
Vcc
tR
VIL
R0201-BS616LV8022
5
Revision 2.4
April 2002
5 Page 
BSI
BS616LV8022
REVISION HISTORY
Revision
2.2
2.3
2.4
Description
2001 Data Sheet release
Date
Note
Apr. 15, 2001
Modify Standby Current (Typ. Jun. 29, 2001
and Max.)
Modify some AC parameters. April,12,2002
Modify 5V ICCSB1_Max(I-grade)
from 50uA to 100uA.
R0201-BS616LV8022
11
Revision 2.4
April 2002
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet BS616LV8022.PDF ] | |
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