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PDF BLV57 Data sheet ( Hoja de datos )
| Número de pieza | BLV57 | |
| Descripción | UHF linear push-pull power transistor | |
| Fabricantes | NXP Semiconductors | |
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DISCRETE SEMICONDUCTORS
DATA SHEET
BLV57
UHF linear push-pull power
transistor
Product specification
Supersedes data of August 1986
1998 Feb 09
1 page  
Philips Semiconductors
UHF linear push-pull power transistor
Product specification
BLV57
3
handbook, full pagewidth
Rth j-h
(K/W)
2.5
2
Th = 120 °C 100 °C
80 °C
60 °C
40 °C
20 °C
MGP360
75 °C
0 °C
100 °C
125 °C
175 °C
150 °C
Tj = 200 °C
1.5
0
20
40
60
80
Ptot (W)
100
Fig.4 Maximum thermal resistance from junction to heatsink as a function of power dissipation, with heatsink
and junction temperature as parameters. (Rth mb-h = 0,25 K/W.)
Example
Nominal class-A push-pull operation (without r.f. signal): VCE = 25 V; IC1 = IC2 = 0,85 A; Th = 70 °C.
Fig.4 shows:
Typical device:
Rth j-h
Tj
Rth j-h
Tj
max.
max.
typ.
typ.
2,68 K/W
184 °C
2,28 K/W
167 °C
1998 Feb 09
5
5 Page 
Philips Semiconductors
UHF linear push-pull power transistor
handbook, full pagewidth
64
11
Product specification
BLV57
73
60
input
+VBB1
+VCC1
L1
C1
L2
C5
L5
C2 C4 L3
C6
C3 L4
L8
C7
C14
C8 C11
C9
L9
L10
L6
L7
L11
L12
C15 C20
C22
C13 L10 C19
C16 L11
C17
C23
C21
C10 C12
C18
L13
R1
L14
+VBB2
+VCC2
output
MGP366
Fig.10 Component layout and printed-circuit board for 860 MHz class-A test circuit.
The circuit and the components are on one side of the PTFE fibre-glass board, the other side is unetched copper to serve
as a ground-plane. Earth connections are made by means of bolts. Additionally copper straps are used under the emitters
and at the input and output to provide direct contact between the copper on the component side and the ground-plane.
1998 Feb 09
11
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet BLV57.PDF ] | |
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