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PDF BLV857 Data sheet ( Hoja de datos )
| Número de pieza | BLV857 | |
| Descripción | UHF linear push-pull power transistor | |
| Fabricantes | NXP Semiconductors | |
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DISCRETE SEMICONDUCTORS
DATA SHEET
BLV857
UHF linear push-pull power
transistor
Product specification
Supersedes data of 1995 Oct 04
1997 Jan 16
1 page  
Philips Semiconductors
UHF linear push-pull power transistor
Product specification
BLV857
APPLICATION INFORMATION
RF performance at Th = 25 °C in a common emitter push-pull class-A test circuit.
MODE OF OPERATION
f
(MHz)
VCE
(V)
ICQ Po sync
(A) (W)
CW class-A
CW class-A
860
25
2 × 1.1
≥10(1)
860
25
2 × 1.1
≥10(2)
Gp
(dB)
≥10(1)
≥10(2)
dim
(dB)
≤−54(1)
≤−51(2)
Notes
1. Three-tone test method: fvision = 855.25 MHz (vision carrier −8 dB); fsound = 860.75 MHz (sound carrier −10 dB);
fsideband = 859.68 MHz (sideband signal −16 dB); 0 dB corresponds to peak sync level.
2. Three-tone test method: fvision = 855.25 MHz (vision carrier −8 dB); fsound = 860.75 MHz (sound carrier −7 dB);
fsideband = 859.68 MHz (sideband signal −16 dB); 0 dB corresponds to peak sync level.
Ruggedness in class-A operation
The BLV857 is capable of withstanding a load mismatch corresponding to VSWR = 50 : 1 through all phases under the
conditions: VCE = 25 V; ICQ = 2 × 1.1 A; f = 860 MHz; Th = 25 °C; Po sync = 10 W.
handbook,5h0alfpage
Po sync
(W)
40
30
MBH757
(1) (2)
20
10
0
0 2 4 Pi sync (W) 6
VCE = 25 V; ICQ = 2 × 1.1 A; f = 860 MHz; (3-tone; −8/−16/−10 dB).
(1) Th = 25 °C.
(2) Th = 70 °C.
Fig.5 Output power as a function of input power;
typical values.
handbook,1h4alfpage
Gp
(dB)
12
10
MBH758
(1)
(2)
8
6
0 20 40 Po sync (W) 60
VCE = 25 V; ICQ = 2 × 1.1 A; f = 860 MHz; (3-tone; −8/−16/−10 dB).
(1) Th = 25 °C.
(2) Th = 70 °C.
Fig.6 Power gain as a function of output power;
typical values.
1997 Jan 16
5
5 Page 
Philips Semiconductors
UHF linear push-pull power transistor
Product specification
BLV857
PACKAGE OUTLINE
handbook, full pagewidth
2.32
2.20
0.1
19.03
18.77
8.26
8.0
1.66
1.39
5.0
max
14.22
12
5.59
4.57
3.43 6.43
3.17 6.17
5
34
5.59
4.57
1.66
1.39
(3x)
MSA451
Dimensions in mm.
Recommended screw: cheese-head 4-40 UNC/2A. Torque on screw: min. 0.6 Nm; max. 0.75 Nm.
Heatsink compound must be applied sparingly and evenly distributed.
Fig.15 SOT324B.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Jan 16
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet BLV857.PDF ] | |
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