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PDF BDV64B Data sheet ( Hoja de datos )
| Número de pieza | BDV64B | |
| Descripción | PNP SILICON POWER DARLINGTONS | |
| Fabricantes | Power Innovations Limited | |
| Logotipo |  |
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Copyright © 1997, Power Innovations Limited, UK
BDV64, BDV64A, BDV64B, BDV64C
PNP SILICON POWER DARLINGTONS
JUNE 1993 - REVISED MARCH 1997
q Designed for Complementary Use with
BDV65, BDV65A, BDV65B and BDV65C
SOT-93 PACKAGE
(TOP VIEW)
q 125 W at 25°C Case Temperature
q 12 A Continuous Collector Current
B
1
q Minimum hFE of 1000 at 4 V, 5 A
C2
E3
Pin 2 is in electrical contact with the mounting base.
MDTRAA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATING
Collector-base voltage (IE = 0)
Collector-emitter voltage (IB = 0)
Emitter-base voltage
Continuous collector current
Peak collector current (see Note 1)
Continuous base current
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)
Operating junction temperature range
Storage temperature range
Lead temperature 3.2 mm from case for 10 seconds
BDV64
BDV64A
BDV64B
BDV64C
BDV64
BDV64A
BDV64B
BDV64C
NOTES: 1. This value applies for tp ≤ 0.1 ms, duty cycle ≤ 10%
2. Derate linearly to 150°C case temperature at the rate of 0.56 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
ICM
IB
Ptot
Ptot
Tj
Tstg
TL
VALUE
-60
-80
-100
-120
-60
-80
-100
-120
-5
-12
-15
-0.5
125
3.5
-65 to +150
-65 to +150
260
UNIT
V
V
V
A
A
A
W
W
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
1 page  
BDV64, BDV64A, BDV64B, BDV64C
PNP SILICON POWER DARLINGTONS
JUNE 1993 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
ø 4,1
4,0
15,2
14,7
3,95
4,15
4,90
4,70
1,37
1,17
12,2 MAX.
16,2 MAX.
18,0 TYP.
31,0 TYP.
1
1,30
1,10
23
11,1
10,8
2,50 TYP.
0,78
0,50
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab.
PRODUCT INFORMATION
MDXXAW
5
5 Page | ||
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| PDF Descargar | [ Datasheet BDV64B.PDF ] | |
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