AG302-86PCB Datasheet PDF - ETC
| Part Number | AG302-86PCB | |
| Description | InGaP HBT Gain Block | |
| Manufacturers | ETC | |
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AG302-86www.DataSheet4U.com
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
x DC – 6000 MHz
x +13.5 dBm P1dB at 900 MHz
x +26 dBm OIP3 at 900 MHz
x 15.5 dB Gain at 900 MHz
x Single Voltage Supply
x Green SOT-86 SMT Package
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
The AG302-86 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG302-86 typically provides
15.5 dB gain, +26 dBm OIP3, and +13.5 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 100 years at
mounting temperatures of +85 qC & is housed in a SOT-86
(micro-X) industry-standard SMT lead-free/green/RoHS-
compliant package.
The AG302-86 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG302-86 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
GND
4
RF In 1
3 RF Out
2
GND
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3 (2)
Output IP2
Output P1dB
Noise Figure
Test Frequency
Gain
Output IP3 (2)
Output P1dB
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
13.3
Typ
900
15.6
20
18
+25.9
+37
+13.5
3.2
1900
14.3
+25.0
+12.2
4.23
35
Max
6000
15.3
1. Test conditions: 25º C, Supply Voltage = +5 V, Rbias = 22.1 ¡ , 50 ¡ System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. The junction temperature ensures a minimum MTTF rating of 1 million hours of usage.
Typical Performance (1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
16.0
-19
-21
+13.3
+26.4
3.2
Typical
900 1900
15.6 14.3
-20 -21
-18 -13
+13.5 +12.2
+25.9 +25.0
3.2 3.4
2140
14.0
-25
-12
+11.7
+24.3
3.4
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 qC
-55 to +125 qC
+5 V
+10 dBm
+250q C
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No. Description
AG302-86*
AG302-86G
AG302-86PCB
InGaP HBT Gain Block
(lead-tin SOT-86 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 Pkg)
700 – 2400 MHz Fully Assembled Eval. Board
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
Page 1 of 6 June 2005
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AG302-86www.DataSheet4U.com
InGaP HBT Gain Block
The Communications Edge TM
Product Information
AG302-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with a “D”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 0
Value:
Passes at 150 V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class II
Value:
Passes at 250 V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 1
Standard: JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010” ).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85 qC
310 qC/W
131 qC
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85 C£ case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 £ C.
1000
100
10
1
60
MTTF vs. GND Pin Temperature
70 80 90 100
GND Pin Temperature (°C)
110
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
¢
¢¢
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