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PDF AG602-89G Data sheet ( Hoja de datos )
| Número de pieza | AG602-89G | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | ETC | |
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AG602-89
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
• DC – 3500 MHz
• +18.5 dBm P1dB at 900 MHz
• +33 dBm OIP3 at 900 MHz
• 14 dB Gain at 900 MHz
• Single Voltage Supply
• Internally matched to 50 Ω
• Lead-free/Green/RoHS-
compliant SOT-89 Package
• MTTF > 1000 years
Applications
• Mobile Infrastructure
• CATV / DBS
• W-LAN / ISM
• RFID
• Defense / Homeland Security
• Fixed Wireless
Product Description
The AG602-89 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG602-89 typically provides 14
dB of gain, +33 dBm Output IP3, and +18.5 dBm P1dB.
The device combines dependable performance with superb
quality to maintain MTTF values exceeding 1000 years at
mounting temperatures of +85°C and is available in both
the standard SOT-89 package and the environmentally-
friendly lead-free/green/RoHS-compliant SOT-89 package.
The AG602-89 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT technology process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG602-89 will work for other various applications
within the DC to 3.5 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3 (2)
Output IP2
Output P1dB
Noise Figure
Test Frequency
Gain
Output IP3 (2)
Output P1dB
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
12.6
Typ
900
14.2
13
15
+33.1
+47
+18.7
4.4
1900
13.6
+33.0
+18.4
5.16
75
Max
3500
14.6
1. Test conditions: 25º C, Supply Voltage = +6 V, Rbias = 11.2 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance (1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
14.4
-12
-16
+18.6
+33.5
4.3
Typical
900 1900
14.2 13.6
-13 -16
-15 -14
+18.7 +18.4
+33.1 +33.0
4.4 4.5
2140
13.5
-16
-14
+18.3
+33.0
4.5
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
+7 V
+10 dBm
+250° C
Ordering Information
Part No.
AG602-89
AG602-89G
AG602-89PCB
Description
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
September 2004
1 page  
AG602-89
InGaP HBT Gain Block
The Communications Edge TM
Product Information
AG602-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG602-89G will be marked with an
“A602G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 0
Value:
Passes at 150 V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class II
Value:
Passes at 250 V
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
Rating
-40 to +85°C
154° C/W
145° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5.16V, 75 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 °C.
MTTF vs. GND Tab Temperature
1000
100
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
10
1
60 70 80 90 100 110 120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
September 2004
5 Page | ||
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