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부품번호 ADP1201
기능 PRECISION SEMICONDUCTOR PRESSURE SENSOR
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ADP1201 데이터시트, 핀배열, 회로
PRECISION
SEMICONDUCTOR
PRESSURE SENSOR
PF (ADP1)
PF PRESSURE
SENSOR
Silicon
<Cross-section of Sensor Chip>
Piezo resistance
strain gauge
Anode
junction
Pressure Glass
base
Highly reliable wire
bonding technology
High reliability
die bonding
technology
Very strong,
heat resistant body
Pressure
A wide range of rated pressure,
including a minute pressure
There are 10 types of sensors covering a
wide range of rated pressure from a
minute pressure between 4.9 kPa {0.05
kgf/cm2}, to a maximum pressure of
980.7 kPa {10 kgf/cm2}.
Realization of highly accurate, linear
characteristics
This sensor employs a semiconductor
strain gauge method, ensuring accurate
and linear detection characteristics. It
also has excellent repeatability of pres-
sure characteristics.
• Impressive line-up of models
• Taking their place alongside the stan-
dard 5kbridge resistance models are
those with a 3.3kresistance which is
optimally suited to 5V drive circuits.
• Economy model (no glass base) gives
outstanding value for consumer appli-
ances
40 kPa (0.4 kgf/cm2) and 49 kPa (0.5
kgf/cm2) units are also available.
ORDERING INFORMATION
Ex. ADP
1
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm2}
Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F
100
50
0 0 {0}
49 {0.5}
98.1 {1}
Pressure (gauge pressure), (kPa {kgf/cm2})
TYPICAL
APPLICATIONS
• Medical equipment: Electronic hemody-
namometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
Part No.
ADP1:
PF pressure sensor
Terminal profile and direction
1: DIP terminal: Dirtection opposite the
pressure inlet direction
2: DIP terminal: Pressure inlet direction
Rated pressure
0: 4.9 kPa {approx. 0.05 kgf/cm2}
1: 14.7 kPa {approx. 0.15 kgf/cm2}
2: 34.3 kPa {approx. 0.35 kgf/cm2}
3: 49.0 kPa {approx. 0.5 kgf/cm2}
4: 98.1 kPa {approx. 1.0 kgf/cm2}
5: 196.1 kPa {approx. 2.0 kgf/cm2}
6: 343.2 kPa {approx. 3.5 kgf/cm2}
7: 490.3 kPa {approx. 5.0 kgf/cm2}
8: 833.6 kPa {approx. 8.5 kgf/cm2}
9: 980.7 kPa {approx. 10.0 kgf/cm2}
A: 40.0 kPa {approx. 0.4 kgf/cm2}
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
Bridge resistance
Nil : 5.0k
3 : 3.3k
Pressure
Bridge resistance
Terminal
Standard
type
(With glass
base)
Economy type
(Without glass
base)
4.9kPa
14.7kPa
34.3kPa
49.0kPa
98.1kPa
196.1kPa
343.2kPa
490.3kPa
833.6kPa
980.7kPa
40.0kPa
49.0kPa
approx. 0.05kgf/cm2
approx. 0.15kgf/cm2
approx. 0.35kgf/cm2
approx. 0.5kgf/cm2
approx. 1.0kgf/cm2
approx. 2.0kgf/cm2
approx. 3.5kgf/cm2
approx. 5.0kgf/cm2
approx. 8.5kgf/cm2
approx. 10.0kgf/cm2
approx. 0.4kgf/cm2
approx. 0.5kgf/cm2
DIP terminal:
Direction opposite
the pressure inlet
direction
ADP1101
ADP1111
ADP1121
ADP1131
ADP1141
ADP1151
ADP1161
ADP1171
ADP1181
ADP1191
——
ADP1132
5.0k
DIP terminal:
Pressure inlet
direction
ADP1201
ADP1211
ADP1221
ADP1231
ADP1241
ADP1251
ADP1261
ADP1271
ADP1281
ADP1291
——
ADP1232
DIP terminal:
Direction opposite
the pressure inlet
direction
——
——
——
——
——
——
——
——
——
——
ADP11A23
——
3.3k
DIP terminal:
Pressure inlet
direction
——
——
——
——
——
——
——
——
——
——
ADP12A23
——
27




ADP1201 pdf, 반도체, 판매, 대치품
PF (ADP1)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C 500°F, 5
sec.
Soldering iron: 260 to 300°C 500 to
572°F (30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 4 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
Constant current
Amplifier circuit unit
circuit unit
Pressure
sensor OP
AMP
OP
AMP
OP
AMP
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
Methods of transmitting air pressures
When the pressure
is low
(4.9 to 98.1 kPa)
Printed-
circuit
board
When the pressure
is high
(196.1 to 980.7 kPa)
Printed-
circuit
board
Tube
O-ring
Pressure
inlet pipe
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
12/1/2002
All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.

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