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AD9000 데이터시트 PDF




Analog Devices에서 제조한 전자 부품 AD9000은 전자 산업 및 응용 분야에서
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부품번호 AD9000 기능
기능 High Speed 6-Bit A/D Converter
제조업체 Analog Devices
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AD9000 데이터시트, 핀배열, 회로
a
FEATURES
77 MSPS Encode Rate
Bipolar Input Range
Low Error Rate
Overflow Bit
MIL-STD-883 Compliant Versions Available
APPLICATIONS
QAM Telecommunications
Electronic Warfare (ECM, ECCM, ESM)
Radar Guidance Digitizers
High Speed
6-Bit A/D Converter
AD9000
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION
The AD9000 is a 6-bit, high speed, analog-to-digital converter
with ECL compatible outputs and a bipolar input stage. The
AD9000 is fabricated in a high performance bipolar process that
allows encode rates up to 77 MSPS.
The AD9000 employs the standard flash converter architecture
based on 64 individual comparators which simultaneously
determine the precise analog signal level. The comparators are
followed by two stages of decoding logic, allowing the AD9000
to operate with a very low error rate. The low 35 pF input
capacitance of the AD9000 greatly simplifies the analog driver
stage. An overflow output bit is also incorporated into the
AD9000 design as is a hysteresis control pin to modify compara-
tor sensitivity.
The AD9000 is offered as both a commercial temperature range
device, 0°C to +70°C, and as an extended temperature range
device, –55°C to +125°C. Both versions are available packaged
in a 16-pin ceramic DIP. The extended temperature range
device is also available in a 28-pin ceramic LCC package. The
extended temperature range versions are offered as fully compli-
ant MIL-STD-883 Class B devices.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
© Analog Devices, Inc., 1997




AD9000 pdf, 반도체, 판매, 대치품
AD9000
DIE LAYOUT
Device
ORDERING GUIDE1
Temperature
Range
Description
Package
Option2
AD9000JD
AD9000SD
AD9000SE
0°C to +70°C
–55°C to +125°C
–55°C to +125°C
16-Pin DIP, Industrial D-16
16-Pin DIP
D-16
28-Pin LCC
E-28A
NOTES
1MIL-STD-883 versions available, contact factory.
2D = Ceramic DIP; E = Leadless Ceramic Chip Carrier.
PIN DESIGNATIONS
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . 129 × 217 × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil Aluminum; Ultrasonic Bonding
or 1 mil Gold; Gold Ball Bonding
Pin Name
Description
PIN DESCRIPTIONS
–VS
ANALOG GROUND
VH
ENCODE
–VREF
AIN
+VS
+VREF
BIT 6 (LSB)
BIT 5 – BIT 2
BIT 1 (MSB)
OVERFLOW
DIGITAL GROUND
Negative supply terminal, nominally –5.2 V.
Analog ground return. All grounds should be connected together near the AD9000.
The hysteresis control voltage varies the comparator hysteresis from 15 mV to 50 mV, for a change of 0 V
to +3 V at the hysteresis control pin.
The ENCODE pin controls the conversion cycle. Encode is rising edge sensitive and should be driven
with a 50% duty-cycle waveform under normal conditions.
The most negative reference voltage for the internal resistor ladder.
Analog input pin.
Positive supply terminal, nominally +5.0 V.
Most positive reference voltage of the internal resistor ladder.
One of six digital outputs. BIT 6 (LSB) is the least-significant-bit of the digital output.
One of six digital outputs.
One of six digital outputs. BIT 1 (MSB) is the most-significant-bit of the digital output.
Overflow data output. Logic high indicates an input overvoltage (AIN +VREF).
Digital ground return. All grounds should be connected together near the AD9000.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD9000 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4– REV. A

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AD9000 전자부품, 판매, 대치품
TYPICAL APPLICATION
The AD9000 is a relatively flexible device that can be config-
ured in a number of ways. One very useful feature of the
AD9000 is the open emitter outputs. The open emitters allow
the outputs of several AD9000s to be OR-wired in stacking
applications for increased resolution. This kind of application
depends on the return-to-zero nature of the output bits when
AIND+ VREF (overflow). In circuits that employ only one
AD9000, this is not always an advantage. The circuit below
illustrates one method of converting the outputs to nonreturn-
to-zero.
The 10197 (standard 10K ECL logic) hex-AND group senses
the active OVERFLOW output and forces all other bits to logic
AD9000
HIGH. The 10151 latch is not required for AD9000 applica-
tions, but it may ease data transfer sensitivities in asynchronous
data collection systems.
The reference driver circuits should provide a low source im-
pedance to prevent noise on the reference inputs from affecting
the AD9000’s accuracy. This is accomplished to a large extent
by adequately decoupling the reference pins to ground. An
improved method is employed below. The reference voltages
(+VREF, –VREF) are buffered by a transistor/amplifier combina-
tion. This has the advantages of wide bandwidth (hence low
impedance over a wide frequency range to eliminate high
frequency noise components), and improved temperature
stability.
REV. A
Figure 6.
–7–

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