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AD7302 데이터시트 PDF




Analog Devices에서 제조한 전자 부품 AD7302은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 AD7302 자료 제공

부품번호 AD7302 기능
기능 2.7 V to 5.5 V/ Parallel Input Dual Voltage Output 8-Bit DAC
제조업체 Analog Devices
로고 Analog Devices 로고


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AD7302 데이터시트, 핀배열, 회로
a
FEATURES
Two 8-Bit DACs In One Package
20-Lead DIP/SOIC/TSSOP Package
+2.7 V to +5.5 V Operation
Internal and External Reference Capability
DAC Power-Down Function
Parallel Interface
On-Chip Output Buffer
Rail-to-Rail Operation
Low Power Operation 3 mA max @ 3.3 V
Power-Down to 1 A max @ 25؇C
APPLICATIONS
Portable Battery Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
2.7 V to 5.5 V, Parallel Input
Dual Voltage Output 8-Bit DAC
AD7302
FUNCTIONAL BLOCK DIAGRAM
AD7302
INPUT
REGISTER
DAC
REGISTER
I DAC A
I/V
VOUTA
D7
D0
INPUT
REGISTER
DAC
REGISTER
I DAC B
I/V
VOUTB
A/B
WR
CONTROL
LOGIC
CS
MUX
POWER ON
RESET
÷2 AGND
PD CLR
LDAC
REFIN VDD DGND
GENERAL DESCRIPTION
The AD7302 is a dual, 8-bit voltage out DAC that operates
from a single +2.7 V to +5.5 V supply. Its on-chip precision
output buffers allow the DAC outputs to swing rail to rail. The
AD7302 has a parallel microprocessor and DSP-compatible
interface with high speed registers and double buffered interface
logic. Data is loaded to the registers on the rising edge of CS or
WR and the A/B pin selects either DAC A or DAC B.
Reference selection for AD7302 can be either an internal
reference derived from the VDD or an external reference applied
at the REFIN pin. Both DACs can be simultaneously updated
using the asynchronous LDAC input and can be cleared by
using the asynchronous CLR input.
The low power consumption of this part makes it ideally suited
to portable battery operated equipment. The power consump-
tion is less than 10 mW at 3.3 V, reducing to 3 µW in power-
down mode.
The AD7302 is available in a 20-pin plastic dual-in-line package,
20-lead SOIC and a 20-lead TSSOP package.
PRODUCT HIGHLIGHTS
1.␣ Low Power, Single Supply Operation. This part operates
from a single +2.7 V to +5.5 V supply and typically consumes
15 mW at 5 V, making it ideal for battery powered applications.
2.␣ The on-chip output buffer amplifiers allow the outputs of the
DACs to swing rail to rail with a settling time of typically 1.2 µs.
3.␣ Internal or external reference capability.
4.␣ High speed parallel interface.
5. Power-Down Capability. When powered down the DAC
consumes less than 1 µA at 25°C.
6. Packaged in 20-lead DIP, SOIC and TSSOP packages.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
© Analog Devices, Inc., 1997




AD7302 pdf, 반도체, 판매, 대치품
AD7302
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Reference Input Voltage to AGND . . . .–0.3 V to VDD + 0.3␣ V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 0.3 V
VOUTA, VOUTB to AGND . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 900 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 102°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 700 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 143°C/W
Lead Temperature, Soldering
␣ ␣ Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
␣ ␣ Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 870 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 74°C/W
Lead Temperature, Soldering
␣ ␣ Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
␣ ␣ Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7302 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
AD7302BN
AD7302BR
AD7302BRU
Temperature
Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Package
Options*
N-20
R-20
RU-20
*N = Plastic DIP; R = Small Outline; RU =Thin Shrink Small Outline.
–4– REV. 0

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AD7302 전자부품, 판매, 대치품
800
720 VDD = 5V AND 3V
INTERNAL REFERENCE
640 TA = +25 C
DAC LOADED WITH 00HEX
560
480
400
320
240
160
80
0
0 24 6
SINK CURRENT – mA
8
␣ Figure 2. Output Sink Current Capa-
␣ bility with VDD = 3 V and VDD = 5 V
0.5
0.45
0.4
VDD = 5V
TA = +25؇C
0.35
0.3 INL ERROR
0.25
0.2
0.15
DNL ERROR
0.1
0.05
0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
REFERENCE VOLTAGE – Volts
␣ ␣ ␣ ␣ Figure 5. Relative Accuracy vs.
␣ ␣ ␣ ␣ External Reference
Typical Performance Characteristics–AD7302
5
4.92
4.84
4.76
4.68
4.6
4.52
4.44
4.36
4.28
VDD = 5V
INTERNAL REFERENCE
DAC REGISTER LOADED
WITH FFHEX
TA = +25°C
4.2
0
2 46
SOURCE CURRENT – mA
8
Figure 3. Output Source Current
Capability with VDD = 5 V
3.5
3.25
3.0
2.75
2.5
2.25
2.0
1.75
1.5
1.25
1.0
0
VDD = 3V
INTERNAL REFERENCE
DAC REGISTER LOADED
WITH FFHex
TA = +25°C
1 2 34 5 6
SOURCE CURRENT – mA
7
8
Figure 4. Output Source Current
Capability with VDD = 3 V
5.0
4.5
4.0
3.5 VDD = 5.5V
3.0
2.5
2.0 VDD = 3.3V
1.5
INTERNAL REFERENCE
1.0 LOGIC INPUTS = VDD OR GND
BOTH DACS ACTIVE
0.5
0
–50 –25 0
25 50 75 100 125
TEMPERATURE – C
Figure 6. Typical Supply Current
vs. Temperature
7.0
BOTH DACS ACTIVE
INTERNAL REFERENCE USED
6.0 TA = +25°C
5.0
LOGIC INPUTS = VIH OR VIL
4.0
3.0
2.0
1.0
2.5
LOGIC INPUTS = VDD OR GND
3.0 3.5 4.0 4.5
VDD – Volts
5.0
5.5
Figure 7. Typical Supply Current
vs. Supply Voltage
10
5
0
–5
–10
–15
–20
–25
–30
VDD = 5V
EXTERNAL SINEWAVE REFERENCE
–35
DAC REGISTER LOADED WITH FFHEX
TA = +25°C
–40
1
10 100 1k 10k
FREQUENCY – Hz
␣ ␣ ␣ ␣ ␣ ␣ Figure 8. Large Scale Signal
␣ ␣ ␣ ␣ ␣ ␣ Frequency Response
WR
1
T
2
VOUT
VOUT
VDD = 3V
INTERNAL VOLTAGE
REFERENCE
FULL SCALE CODE
3
CHANGE 00H-FFH
TA = +25°C
CH1 5V, CH2 1V, CH3 20mV
TIME BASE = 200 ns/Div
Figure 9. Full-Scale Settling Time
PD
2
VOUT
1
AD7302 POWER-UP TIME
VDD = 5V
INTERNAL REFERENCE
DAC IN POWER-DOWN INITIALLY
CH1 = 2V/div, CH2 = 5V/Div,
TIME BASE = 2 µs/Div
␣ Figure 10. Exiting Power-Down (Full
␣ Power-Down)
REV. 0
–7–

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