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AA028N1-99 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 AA028N1-99
기능 23-30 GHz Low Noise Amplifier
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AA028N1-99 데이터시트, 핀배열, 회로
23–30 GHz Low Noise Amplifier
Features
I 3 dB Noise Figure
I 18 dB Gain
I +9 dBm Output Power
I Rugged, Reliable Package
I Single Voltage Operation
I 100% RF and DC Testing
0.022
(0.56 mm)
0.180
(4.57 mm)
0.090
(2.29 mm)
AA028N1-99
0.295 (7.49 mm)
0.225
(5.72 mm)
0.011
(0.28 mm)
AA028N1-99
YYWW
PIN 1
INDICATOR
0.008
(0.20 mm)
Description
The AA028N1-99 is a broadband millimeterwave amplifier
in a rugged package. The amplifier is designed for use in
millimeterwave communication and sensor systems as the
receiver front-end or transmitter gain stage when high
gain, wide dynamic range, and low noise figure are
required. The robust ceramic and metal package provides
excellent electrical performance, excellent thermal
performance, and a high degree of environmental
protection for long-term reliability. A single supply voltage
simplifies bias requirements. All amplifiers are screened
at the operating frequencies prior to shipment for
guaranteed performance. Amplifier is targeted for
millimeterwave point-to-point and point-to-multipoint
wireless communications systems.
0.028
(0.71 mm)
Block Diagram
LNA
0.057
(1.45 mm)
Electrical Specifications at 25°C (VD1 = VD2 = +5.5 V)
RF
Parameter
Bandwidth
Small Signal Gain
Noise Figure
Input Return Loss
Output Return Loss
Output Power at 1 dB Gain Compression
Temperature Coefficient of Gain
DC
Drain Current 1
Drain Current 2
Total Drain Current
Parameter
Symbol
BW
G
NF
RLI
RLO
P1 dB
dG/dT
Symbol
ID1
ID2
ID1 + ID2
Min. Typ. Max. Unit
23
22–31
30
GHz
15 18
dB
2.9 3.5 dB
11 dB
13 dB
69
dBm
-0.016
dB/C
Min. Typ. Max. Unit
20 mA
22 mA
42 60 mA
Alpha Industries, Inc. [781] 935-5150 Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 10/99A
1




AA028N1-99 pdf, 반도체, 판매, 대치품
2330 GHz Low Noise Amplifier
AA028N1-99
Co-Planar Millimeterwave Package
Handling/Mounting
Co-planar packages (Figure 1) require careful mounting
design to maintain optimal performance and to minimize
VSWR interactions. A connection to the ground pads on
either side of the RF line is optional and will depend on
the type of material and geometry of the interface at the
RF ports.
Handling
In general the co-planar ceramic package is quite rugged.
However, due to ceramics brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
The Cu-Mo-Cu base of this package is very durable,
however, care should be exercised when attaching with
screw hardware on packages which come with screw
holes. Over-tightening of screws could deform the base,
which could cause cracks in the ceramic walls. Only
personnel trained in both ESD precautions, and handling
precautions should be allowed to handle these packages.
Microstrip Mounting
An example of a co-planar microstrip launch is illustrated
in Figure 2 using an equal height dielectric material. A hole
is cut into the circuit board to allow the package to be
mounted directly to the circuit ground plane. The hole
should be cut as close to the outer dimensions of the
package to minimize RF gap distances.
It is preferred to match (mirror) the geometry of the
package interface to achieve best results. Three
5 x 1/4 mil ribbon bonds will complete the connection
providing a minimum discontinuity connection. Multiple
bondwires are also acceptable.
Surface Mounting
Mounting of the package to the surface (Figure 3) of a
circuit can be accomplished by using a series of via holes
to provide ground for the package. Although, this method
is not preferred it can be done if careful design practices
are used. Via spacing and size may have a strong effect
on high frequency performance of the package.
Package Attachment
The package can be conductive epoxy attached to its
mounting surface using either a paste or film media. SnPb
eutectic attachment can also be used in situations were
heat removal is important. Some packages allow for
hardware mounting. Care should be taken to ensure good
ground contact is maintained.
RF/DC Bondwire Attachment
Standard thermosonic ball or ribbon attachment is used
to make the connections to the RF and DC interfaces.
When designing the layout, be aware that most bonding
machines have a limited reach and may require special
tooling to wire/ribbon bond in center of a large circuit.
RF In
RF Out
RF In
RF Out
Figure 1. Co-Planar Packages
Package
Launch
Circuit
Board
Figure 2. Microstrip Mount
Package
Circuit
Board
Figure 3. Surface Mount
4 Alpha Industries, Inc. [781] 935-5150 Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 10/99A

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부품번호상세설명 및 기능제조사
AA028N1-99

23-30 GHz Low Noise Amplifier

Alpha Industries
Alpha Industries

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