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PDF HSSR-7111 Data sheet ( Hoja de datos )
| Número de pieza | HSSR-7111 | |
| Descripción | 90 V/1.0 W/ Hermetically Sealed/ Power MOSFET Optocoupler | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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90 V/1.0 Ω, Hermetically Sealed,
Power MOSFET Optocoupler
Technical Data
HSSR-711X*
5962-9314001
*See matrix for available extensions
Features
• Dual Marked with Device
Part Number and DSCC
Standard Microcircuit
Drawing
• ac/dc Signal & Power
Switching
• Compact Solid-State
Bidirectional Switch
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534
• MIL-PRF-38534 Class H
• Space Level Processing
Available
• Hermetically Sealed 8-Pin
Dual In-Line Package
• Small Size and Weight
• Performance Guaranteed
over -55°C to +125°C
• Connection A
0.8 A, 1.0 Ω
• Connection B
1.6 A, 0.25 Ω
• 1500 Vdc Withstand Test
Voltage
• High Transient Immunity
• 5 Amp Output Surge Current
Applications
• Military and Space
• High Reliability Systems
• Standard 28 Vdc and 48 Vdc
Load Driver
• Standard 24 Vac Load Driver
• Aircraft Controls
• ac/dc Electromechanical and
Solid State Relay
Replacement
• I/O Modules
• Harsh Industrial
Environments
Description
The HSSR-7110, HSSR-7111 and
SMD 5962-9314001 are single
channel power MOSFET
optocouplers, constructed in
eight-pin, hermetic, dual-in-line,
ceramic packages. The devices
operate exactly like a solid-state
relay. The products are capable of
operation and storage over the
full military temperature range
and can be purchased as a
standard product (HSSR-7110),
with full MIL-PRF-38534 Class H
testing (HSSR-7111), or from the
DSCC Standard Microcircuit
Drawing (SMD) 5962-93140.
These devices may be purchased
with a variety of lead bend and
plating options. See Selection
Guide Table for details. Standard
Microcircuit (SMD) parts are
available for each lead style.
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
1 NC
IF
+2
VF
–3
IO
8+
7
VO
6
4 NC
5–
CONNECTION B
DC CONNECTION
1 NC
IF
+2
VF
–3
8
7
6
IO
+
VO
–
4 NC
5
TRUTH TABLE
INPUT OUTPUT
H CLOSED
L OPEN
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
1 page  
5
Electrical Specifications
TA =-55°C to +125°C, unless otherwise specified. See note 9.
Parameter
Sym.
Group
A, Sub-
group
Test Conditions
Min. Typ.* Max. Units Fig. Notes
Output Withstand
Voltage
|VO(OFF)| 1, 2, 3 VF = 0.6 V, IO = 10 µA
90 110
V5
Output Connection
On- A
Resistance
Connection
B
R(ON)
1, 2, 3 IF = 10 mA, IO = 800 mA,
(pulse duration ≤ 30 ms)
IF = 10 mA, IO = 1.6 A,
(pulse duration ≤ 30 ms)
0.40 1.0 Ω 6,7 3
0.12 0.25
Output Leakage
Current
IO(OFF) 1, 2, 3 VF = 0.6 V, VO = 90 V,
10-4 10 µA
8
Input Forward
Voltage
VF 1, 2, 3 IF = 10 mA
1.0 1.24 1.7 V
9
Input Reverse
Breakdown Voltage
VR 1, 2, 3 IR = 100 µA
5.0
V
Input-Output
Insulation
Turn On Time
II-O 1 RH ≤ 45%, t = 5 s,
VI-O = 1500 Vdc,
TA = 25°C
tON 9, 10, 11 IF = 10 mA, VDD = 28 V,
IO = 800 mA
1.0 µA
4, 5
1.25 6.0
ms 1,10,
11, 12,
13
Turn Off Time
tOFF 9,10,11 IF = 10 mA,
VDD = 28 V, IO = 800 mA
0.02
Output Transient
Rejection
dVo 9 VPEAK = 50 V,
1000
dt CM = 1000 pF,
CL = 15 pF, RM ≥ 1 MΩ
Input-Output
Transient Rejection
dVio
dt
9 VDD = 5 V,
500
VI–O(PEAK) = 50 V,
RL = 20 kΩ, CL = 15 pF
*All typical values are at TA = 25°C, IF(ON) = 10 mA, VF(OFF) = 0.6 V unless otherwise specified.
0.25
ms
V/µs
V/µs
1,10,
14,15
17
18
5 Page 
11
VIN
5.5 V
RIN
200 Ω
HSSR-7110
18
27
36
45
Figure 20. Burn-In Circuit.
ROUT
1.0 Ω
VO (SEE NOTE)
ROUT
1.0 Ω
NOTE:
IN ORDER TO DETERMINE VOUT CORRECTLY, THE CASE TO AMBIENT THERMAL IMPEDANCE MUST
BE MEASURED FOR THE BURN-IN BOARDS TO BE USED. THEN, KNOWING θCA, DETERMINE THE
CORRECT OUTPUT CURRENT PER FIGURES 2 AND 4 TO INSURE THAT THE DEVICE MEETS THE
DERATING REQUIREMENTS AS SHOWN.
Tje Tjf1 Tjd Tjf2
104 15
15
TC
15
θCA
TA
Tje = LED JUNCTION TEMPERATURE
Tjf1 = FET 1 JUNCTION TEMPERATURE
Tjf2 = FET 2 JUNCTION TEMPERATURE
Tjd = FET DRIVER JUNCTION TEMPERATURE
TC = CASE TEMPERATURE (MEASURED AT CENTER
OF PACKAGE BOTTOM)
TA = AMBIENT TEMPERATURE (MEASURED 6" AWAY
FROM THE PACKAGE)
θCA = CASE-TO-AMBIENT THERMAL RESISTANCE
ALL THERMAL RESISTANCE VALUES ARE IN °C/W
Figure 21. Thermal Model.
Applications Information
Thermal Model
The steady state thermal model
for the HSSR-7110 is shown in
Figure 21. The thermal resistance
values given in this model can be
used to calculate the temperatures
at each node for a given operating
condition. The thermal resistances
between the LED and other
internal nodes are very large in
comparison with the other terms
and are omitted for simplicity.
The components do, however,
interact indirectly through θCA,
the case-to-ambient thermal
resistance. All heat generated
flows through θCA, which raises
the case temperature TC accord-
ingly. The value of θCA depends on
the conditions of the board design
and is, therefore, determined by
the designer.
The maximum value for each out-
put MOSFET junction-to-case
thermal resistance is specified as
15°C/W. The thermal resistance
from FET driver junction-to-case
is also 15°C/W. The power
dissipation in the FET driver,
however, is negligible in compar-
ison to the MOSFETs.
On-Resistance and Rating
Curves
The output on-resistance, RON,
specified in this data sheet, is the
resistance measured across the
output contact when a pulsed
current signal (IO = 800 mA) is
applied to the output pins. The use
of a pulsed signal (≤ 30 ms)
implies that each junction
temperature is equal to the ambient
and case temperatures. The steady-
state resistance, RSS, on the other
hand, is the value of the resistance
measured across the output contact
when a DC current signal is applied
to the output pins for a duration
sufficient to reach thermal
equilibrium. RSS includes the effects
of the temperature rise of each
element in the thermal model.
Rating curves are shown in Figures
2 and 4. Figure 2 specifies the
maximum average output current
allowable for a given ambient
temperature. Figure 4 specifies the
output power dissipation allowable
for a given ambient temperature.
Above 55°C (for θCA = 80°C/W) and
107°C (for θCA = 40°C/W), the
maximum allowable output current
and power dissipation are related
by the expression RSS = PO(max)/
(IO(max))2 from which RSS can be
calculated. Staying within the safe
area assures that the steady-state
junction temperatures remain less
than 150°C. As an example, for TA
= 95°C and θCA = 80°C/W, Figure 2
shows that the output current
should be limited to less than
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet HSSR-7111.PDF ] | |
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