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PDF HSSR-8400 Data sheet ( Hoja de datos )

Número de pieza HSSR-8400
Descripción 60 V/0.7 Ohm/ General Purpose/ 1 Form A/ Solid State Relay
Fabricantes Agilent(Hewlett-Packard) 
Logotipo Agilent(Hewlett-Packard) Logotipo



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60 V/0.7 Ohm,
General Purpose, 1 Form A,
Solid State Relay
Technical Data
HSSR-8060
Features
• Compact Solid-State
Bidirectional Switch
• Normally-Off Single-Pole
Relay Function (1 Form A)
• 60 V Output Withstand
Voltage in Both Polarities at
25°C
• 0.75/1.5 Amp Current
Ratings (See Schematic for
Connections A & B)
• Low Input Current; CMOS
Compatibility
• Very Low On-resistance:
0.4 Typical at 25°C
• ac/dc Signal and Power
Switching
• Input-to-Output Momentary
Withstand Insulation
Voltage: 2500 Vac, 1 Minute
• 16-kV ESD Immunity: MIL-
STD-883, Method 3015
• IEEE Surge Withstand
Capability (IEEE STD
472-1974)
• CSA Approved
• UL 508 Approved
Applications
• Programmable Logic
Controllers
• Telecommunication
Switching Equipment
• Reed Relay Replacement
• 28 Vdc, 24 Vac, 48 Vdc Load
Driver
• Industrial Relay Coil Driver
Description
The HSSR-8060 consists of a
high-voltage circuit, optically
coupled with a light emitting
diode (LED). This device is a
solid-state replacement for single-
pole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power loads. The
relay turns on (contact closes)
with a minimum input current, IF,
of 5 mA through the input LED.
The relay turns off (contact
opens) with an input voltage, VF,
of 0.8 V or less. The detector
contains a high speed photosensi-
tive FET driver circuit and two
high voltage MOSFETs.
This relay’s logic level input con-
trol and very low typical output
on-resistance of 0.4 makes it
suitable for both ac and dc loads.
Connection A, as shown in the
schematic, allows the relay to
switch either ac or dc loads.
Connection B, with the polarity
and pin configuration as indicated
in the schematic, allows the relay
to switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The electrical and switching char-
acteristics of the HSSR-8060 are
specified from -40°C to +85°C.
Functional Diagram
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

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HSSR-8400 pdf
5
Insulation and Safety Related Specifications
Parameter
Symbol Value Units
Conditions
Min. External Air Gap
(External Clearance)
L(IO1) 7.0 mm Measured from input terminals to output
terminals, shortest distance through air
Min. External Tracking Path
(External Creepage)
L(IO2) 8.5 mm Measured from input terminals to output
terminals, shortest distance path along body
Min. Internal Plastic Gap
(Internal Clearance)
0.5 mm Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
Tracking Resistance
CTI 200 V DIN IEC 112/VDE 0303 PART 1
(Comparative Tracking Index)
Isolation Group
IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Storage Temperature ................................................... -55°C to+125°C
Operating Temperature - TA .......................................... -40°C to +85°C
Case Temperature - TC .......................................................... +105°C[1]
Average Input Current - IF............................................................ 20 mA
Repetitive Peak Input Current - IF ............................................... 40 mA
(Pulse Width 1 ms; duty cycle 50%)
Transient Peak Input Current - IF ............................................... 100 mA
(Pulse Width 200 µs; duty cycle 1%)
Reverse Input Voltage - VR ................................................................ 3 V
Input Power Dissipation .............................................................. 40 mW
Output Voltage (TA = 25°C)
Connection A - VO ......................................................... -60 to +60 V
Connection B - VO ............................................................. 0 to +60 V
Average Output Current - Figure 3 (TA = 25°C, TC 70°C)
Connection A - IO .....................................................................0.75 A
Connection B - IO .....................................................................1.50 A
Single Shot Peak Output Current
(100 ms pulse width, TA = 25°C, IF = 10 mA)
Connection A - IO .................................................................... 3.75 A
Connection B - IO ...................................................................... 7.0 A
Output Power Dissipation ..................................................... 750 mW[2]
Lead Solder Temperature .... 260°C for 10 S (1.6 mm below seating plane)
Infrared and Vapor Phase Reflow Temperature
(Option #300) ......................................... See Fig. 1, Thermal Profile
Thermal Resistance
Typical Output MOSFET Junction
to Case – θJC = 55°C/W
Demonstrated ESD
Performance
Human Body Model: MIL-STD-
883 Method 3015.7 - 16 kV
Machine Model: EIAJ 1988.3.28
Version 2), Test Method 20,
Condition C – 1200 V
Surge Withstand
Capability
IEEE STD 472-1974

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HSSR-8400 arduino
11
Figure 18. Voltage Offset Test Setup.
Tjo = LED JUNCTION TEMPERATURE
T11 = FET 1 JUNCTION TEMPERATURE
T12 = FET 2 JUNCTION TEMPERATURE
Tjd = FET DRIVER JUNCTION TEMPERATURE
TC = CASE TEMPERATURE ( MEASURED AT
CENTER OF PACKAGE BOTTOM)
TA = AMBIENT TEMPERATURE (MEASURED
15 cm AWAY FROM THE PACKAGE)
θCA = CASE-TO-AMBIENT THERMAL RESISTANCE
ALL THERMAL RESISTANCE VALUES ARE IN °C/W.
Figure 19. Thermal Model.
Figure 20. Turn On Time Variation with High Temperature
Operating Life.
Figure 21. Turn On Time Variation with Temperature Cycling.

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