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PDF HSDL3208 Data sheet ( Hoja de datos )
| Número de pieza | HSDL3208 | |
| Descripción | Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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Agilent HSDL-3208
Ultra Small Profile Package
IrDA® Data Compliant Low Power
115.2 kbit/s Infrared Transceiver
Data Sheet
Features
• Fully compliant to IrDA 1.4 low power
specification from 9.6 kbit/s to
115.2 kbit/s
Description
The HSDL-3208 is an ultra-small
low cost infrared transceiver
module that provides the interface
between logic and infrared (IR)
signals for through air, serial, half-
duplex IR data link. The module is
compliant to IrDA Physical Layer
Specifications version 1.4 Low
Power from 9.6 kbit/s to 115.2
kbit/s with extended link distance
and it is IEC 825-Class 1 eye safe.
The HSDL-3208 can be shut
down completely to achieve very
low power consumption. In the
shutdown mode, the PIN diode
will be inactive and thus produc-
ing very little photocurrent even
under very bright ambient light.
Such features are ideal for bat-
tery operated handheld products.
• Miniature package
– Height: 1.60 mm
– Width: 7.00 mm
– Depth: 2.8 mm
• Guaranteed temperature performance,
-25 to +85°C
– Critical parameters are
guaranteed over temperature
and supply voltage
• Low power consumption
– Low shutdown current (1 nA typical)
– Complete shutdown of TXD, RXD,
and PIN diode
• Withstands >100 mVp-p power supply
ripple typically
• Excellent EMI performance without
shield
• VCC supply 2.7 to 3.6 volts
• LED stuck-high protection
• Designed to accommodate light loss
with cosmetic windows
VCC
CX2
• IEC 825-class 1 eye safe
Applications
• IRFM
VCC (6)
CX1
GND (7)
SD (5)
RXD (4)
VCC
TXD (3)
LED C (2)
R1
LED A (1)
HSDL-3208
TRANSMITTER
• Mobile telecom
– Cellular phones
– Pagers
– Smart phones
• Data communication
– PDAs
– Portable printers
• Digital imaging
– Digital cameras
– Photo-imaging printers
Figure 1. Functional block diagram of HSDL-3208.
7 654 321
Figure 2. Rear view diagram with pinout.
1 page  
VOH
VOL
90%
50%
10%
tf
tpw
Figure 3. RXD output waveform.
tr
TXD
LED
tpw (MAX.)
Figure 5. TXD "stuck on" protection waveform.
SD
TXD
TX
LIGHT
tTW
Figure 7. TXD wakeup time waveform.
AVE. TXD RADIANT INTENSITY vs. AVE. TXD ILED_A,
TEMPERATURE = 25°C
21
19
17
15
13
11
9
7
45.0E-3
65.0E-3
85.0E-3
AVE. TXD ILED_A (A)
105.0E-3
Figure 8. LOP vs. ILED.
5
LED ON
LED OFF
90%
50%
10%
tr
Figure 4. LED optical waveform.
tpw
tf
SD
RX
LIGHT
RXD
tRW
Figure 6. Receiver wakeup time waveform.
AVE. TXD ILED_A vs. AVE. TXD VLED_A,
TEMPERATURE = 25°C
100.0E-3
90.0E-3
80.0E-3
70.0E-3
60.0E-3
50.0E-3
40.0E-3
1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58 1.60
AVE. TXD VLED_A (V)
Figure 9. VLED vs. ILED.
5 Page 
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
APERTURES AS PER
LAND DIMENSIONS
l
Figure 16. Solder stencil aperture.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
t
w
Aperture size(mm)
length, l
width, w
2.60 ± 0.05
0.55 ± 0.05
3.00 ± 0.05
0.55 ± 0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
0.2
7.2
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
SOLDER MASK
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 17. Adjacent land keepout and solder mask areas.
UNITS: mm
2.6
3.0
11
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet HSDL3208.PDF ] | |
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