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부품번호 HMU16 기능
기능 16 x 16-Bit CMOS Parallel Multiplier
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HMU16 데이터시트, 핀배열, 회로
HMU16/883
April 1997
16 x 16-Bit CMOS Parallel Multiplier
Features
• This Circuit is Processed in Accordance to MIL-STD-
883 and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
• 16 x 16-Bit Parallel Multiplier with Full 32-Bit Product
• High-Speed (45ns) Clocked Multiply Time
• Low Power CMOS Operation
- ICCSB = 500µA Maximum
- ICCOP = 7.0mA Maximum at 1MHz
• HMU16/883 is Compatible with the AM29516, LMU16,
IDT7216, and the CY7C516
• Supports Two’s Complement, Unsigned Magnitude
and Mixed Mode Multiplication
• TTL Compatible Inputs/Outputs
• Three-State Outputs
Ordering Information
PART NUMBER
HMU16GM-45/883
HMU16GM-60/883
TEMP. RANGE
(oC)
-55 to 125
-55 to 125
PACKAGE
68 Ld CPGA
68 Ld CPGA
PKG.
NO.
N68.95
N68.95
Description
The HMU16/883 is a high speed, low power CMOS 16 x 16-bit
parallel multiplier ideal for fast, real time digital signal pro-
cessing applications. The 16-bit X and Y operands may be
independently specified as either two’s complement or
unsigned magnitude format, thereby, allowing mixed mode
multiplication operations.
Additional inputs are provided to accommodate format
adjustment and rounding of the 32-bit product. The Format
Adjust control allows the user to select a 31-bit product with
the sign bit replicated in the LSP. The round control provides
for rounding the most significant portion of the result by add-
ing one to the most significant bit of the LSP.
Two 16-bit Output Registers (MSP and LSP) are provided to
hold the most and least significant portions of the result,
respectively. These registers may be made transparent for
asynchronous operation through the use of the Feedthrough
Control (FT). The two halves of the product may be routed to
a single 16-bit three-state output port via the output multi-
plexer control, and in addition, the LSP is connected to the Y-
input port through a separate three-state buffer.
The HMU16/883 utilizes independent clock signals (CLKX,
CLKY, CLKL, CLKM) to latch the input operands and output
Product Registers. This configuration maximizes throughput
and simplifies bus interfacing. All outputs of the HMU16/883
also offer three-state control for multiplexing onto multi-use
system busses.
Functional Diagram
X0-15 TCX
RND
TCY Y0-15/P0-15
REGISTER
CLKX
CLKY
FA
FT
CLKM
CLKL
MSPSEL
OEP
REGISTER
REGISTER
OEL
MULTIPLIER ARRAY
FORMAT ADJUST
MSP
LSP
REGISTER REGISTER
MULTIPLEXER
P16-31/P0-15
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
3-29
File Number 2804.2




HMU16 pdf, 반도체, 판매, 대치품
HMU16/883
TABLE 3. HMU16/883 ELECTRICAL PERFORMANCE SPECIFICATIONS
PARAMETER SYMBOL
CONDITIONS
NOTES TEMPERATURE (oC)
-45
MIN MAX
-60
MIN MAX UNITS
Input Capacitance
Output Capacitance
I/O Capacitance
X, Y, RND Hold Time
Three-State Disable
Time
CIN
COUT
CI/O
tH
tDIS
VCC = Open, f = 1MHz
All Measurements are
referenced to device
GND.
1
1
1
1, 2
1, 2, 3
TA = 25
TA = 25
TA = 25
-55 TA 125
-55 TA 125
- 15 - 15 pF
- 10 - 10 pF
- 10 - 10 pF
3 - 3 - ns
- 25 - 30 ns
Output Rise Time
tr From 0.8V to 2.0V
1, 2, 4
-55 TA 125
- 10 - 10 ns
Output Fall Time
tf From 2.0V to 0.8V
1, 2, 4
-55 TA 125
- 10 - 10 ns
NOTES:
8. The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are char-
acterized upon initial design and after major process and/or design changes.
9. Guaranteed, but not 100% tested.
10. Transition is measured at 1200mV from steady state voltage; output loading per test load circuit with V1 = 1.5V, R1 = 500and CL =
40pF.
11. Loading is as specified in the test load circuit, with V1 = 2.4V, R1 = 500and CL = 40pF.
TABLE 4. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
Initial Test
Interim Test
PDA
Final Test
Group A
Groups C and D
METHOD
100%/5004
100%/5004
100%
100%
-
Samples/5005
SUBGROUPS
-
-
1
2, 3, 8A, 8B, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1, 7, 9
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HMU16 전자부품, 판매, 대치품
Die Characteristics
DIE DIMENSIONS:
179 x 169 x 19 ± 1mils
METALLIZATION:
Type: Si - Al or Si-Al-Cu
Thickness: 8kÅ
Metallization Mask Layout
HMU16/883
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ
WORST CASE CURRENT DENSITY: 1.2 x 105A/cm2
HMU16/883
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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