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BAP50-03 데이터시트 PDF




NXP Semiconductors에서 제조한 전자 부품 BAP50-03은 전자 산업 및 응용 분야에서
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BAP50-03 데이터시트, 핀배열, 회로
BAP50-03
General purpose PIN diode
Rev. 04 — 11 September 2009
Product data sheet
1. Product profile
1.1 General description
General purpose PIN diode in a SOD323 small plastic SMD package.
1.2 Features
I Low diode capacitance
I Low diode forward resistance
1.3 Applications
I General RF application
2. Pinning information
Table 1. Discrete pinning
Pin Description
1 cathode
2 anode
Simplified outline Graphic symbol
12
sym006
3. Ordering information
Table 2. Ordering information
Type number Package
Name Description
BAP50-03 SC-76 plastic surface-mounted package; 2 leads
Version
SOD323




BAP50-03 pdf, 반도체, 판매, 대치품
NXP Semiconductors
7. Package outline
Plastic surface-mounted package; 2 leads
DA
BAP50-03
General purpose PIN diode
SOD323
E
X
HD v M A
1
(1)
2
bp
A
A1
detail X
Q
c
Lp
01
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E HD Lp Q
v
mm
1.1
0.8
0.05
0.40
0.25
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45 0.25
0.15 0.15
0.2
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOD323
SC-76
2 mm
Fig 5. Package outline SOD323
BAP50-03_4
Product data sheet
Rev. 04 — 11 September 2009
EUROPEAN
PROJECTION
ISSUE DATE
03-12-17
06-03-16
© NXP B.V. 2009. All rights reserved.
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BAP50-03 전자부품, 판매, 대치품
NXP Semiconductors
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
10.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 6
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
BAP50-03
General purpose PIN diode
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 September 2009
Document identifier: BAP50-03_4

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