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BAT54T1 데이터시트 PDF




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부품번호 BAT54T1 기능
기능 30 VOLT SCHOTTKY BARRIER DETECTOR AND SWITCHING DIODE
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BAT54T1 데이터시트, 핀배열, 회로
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by BAT54T1/D
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.
Extremely Fast Switching Speed
Low Forward Voltage — 0.35 Volts (Typ) @ IF = 10 mAdc
1
Cathode
2
Anode
BAT54T1
Motorola Preferred Device
30 VOLT
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODE
2
1
CASE 425 – 04, STYLE 1
SOD – 123
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating
Symbol
Reverse Voltage
Forward Power Dissipation, FR–5 Board(1)
@ TA = 25°C
Derate above 25°C
VR
PF
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Forward Current (DC)
Non–Repetitive Peak Forward Current
tp < 10 msec
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle = 66%
RθJL
RθJA
IF
IFSM
IFRM
Junction Temperature
Storage Temperature Range
DEVICE MARKING
TJ
Tstg
BAT54T1 = BU
1. FR-5 = 1.0 x 0.75 x 0.062 in.
Preferred devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a registered trademark of the Bergquist Company.
REV 4
©MMoottoorroolal,aInSc.m19a9ll7–Signal Transistors, FETs and Diodes Device Data
Value
30
400
3.2
174
492
200 Max
600
300
125 Max
– 55 to +150
Unit
Volts
mW
mW/°C
°C/W
°C/W
mA
mA
mA
°C
°C
1




BAT54T1 pdf, 반도체, 판매, 대치품
BAT54T1
INFORMATION FOR USING THE SOD–123 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOD–123
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
0.91
0.036
ÉÉÉÉ 1.22
ÉÉÉÉ 0.048
ÉÉÉÉÉÉÉÉ2.36
0.093
4.19
0.165
mm
inches
SOD–123 POWER DISSIPATION
The power dissipation of the SOD–123 is a function of the
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SOD–123
package, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD =
150°C – 25°C
556°C/W
= 225 milliwatts
The 556°C/W for the SOD–123 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 225 milliwatts. There
are other alternatives to achieving higher power dissipation
from the SOD–123 package. Another alternative would be to
use a ceramic substrate or an aluminum core board such as
Thermal Clad. Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

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