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PDF BAV756S Data sheet ( Hoja de datos )

Número de pieza BAV756S
Descripción High-speed switching diode array
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! BAV756S Hoja de datos, Descripción, Manual

BAV756S; BAW56 series
High-speed switching diodes
Rev. 6 — 18 March 2015
Product data sheet
1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1. Product overview
Type number Package
NXP
JEITA
BAV756S
SOT363 SC-88
BAW56
BAW56M
SOT23
SOT883
-
SC-101
BAW56S
SOT363 SC-88
BAW56T
BAW56W
SOT416
SOT323
SC-75
SC-70
JEDEC
-
Package
configuration
very small
TO-236AB small
- leadless ultra
small
- very small
- ultra small
- very small
Configuration
quadruple common
anode/common cathode
dual common anode
dual common anode
quadruple common
anode/common anode
dual common anode
dual common anode
1.2 Features and benefits
High switching speed: trr 4 ns
Low leakage current
Small SMD plastic packages
Low capacitance: Cd 2 pF
Reverse voltage: VR 90 V
AEC-Q101 qualified
1.3 Applications
High-speed switching
General-purpose switching
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Per diode
IR reverse current
VR reverse voltage
trr reverse recovery time
Conditions
Min Typ
VR = 80 V
-
-
[1] -
-
-
-
[1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
Max
0.5
90
4
Unit
A
V
ns

1 page




BAV756S pdf
NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
Table 7.
Symbol
Rth(j-sp)
Thermal characteristics …continued
Parameter
Conditions
thermal resistance from
junction to solder point
BAV756S
BAW56
BAW56S
BAW56T
BAW56W
Min Typ Max Unit
- - 255 K/W
- - 360 K/W
- - 255 K/W
- - 350 K/W
- - 300 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8. Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Per diode
VF forward voltage
[1]
IF = 1 mA
-
IF = 10 mA
-
IF = 50 mA
-
IF = 150 mA
-
IR reverse current VR = 25 V
-
VR = 80 V
-
VR = 25 V; Tj = 150 C -
VR = 80 V; Tj = 150 C -
Cd
diode capacitance
VR = 0 V; f = 1 MHz
-
trr reverse recovery time
[2] -
VFR forward recovery voltage
[3] -
Typ
-
-
-
-
-
-
-
-
-
-
-
[1] Pulse test: tp 300 s;   0.02.
[2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
[3] When switched from IF = 10 mA; tr = 20 ns.
Max Unit
715 mV
855 mV
1V
1.25 V
30 nA
0.5 A
30 A
150 A
2 pF
4 ns
1.75 V
BAV756S_BAW56_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAV756S arduino
NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
2.65
2.35 1.5 0.6 0.5
(4×) (4×)
0.4 (2×)
0.5 0.6
(4×) (2×)
0.6
(4×)
1.8
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot363_fr
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
1.5
4.5 0.3 2.5
1.5
1.3 1.3
2.45
5.3
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot363_fw
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
BAV756S_BAW56_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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