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PDF AM29LV642DU90RPAE Data sheet ( Hoja de datos )
| Número de pieza | AM29LV642DU90RPAE | |
| Descripción | 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control | |
| Fabricantes | Advanced Micro Devices | |
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Am29LV642D
Data Sheet
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-
inally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number 25022 Revision A Amendment 0 Issue Date August 14, 2001
1 page  
PRELIMINARY
PRODUCT SELECTOR GUIDE
Part Number
Speed Option
Max Access Time (ns)
Regulated Voltage Range: VCC = 3.0–3.6 V
CE# Access Time (ns)
OE# Access Time (ns)
Note: See “AC Characteristics” for full specifications.
Am29LV642D
90R 12R
90 120
90 120
35 50
4 Am29LV642D
5 Page 
PRELIMINARY
enabled for read access until the command register
contents are altered.
See “VersatileI/O (VIO) Control” for more information.
Refer to the AC Read-Only Operations table for timing
specifications and to Figure 13 for the timing diagram.
ICC1 in the DC Characteristics table represents the ac-
tive current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which in-
cludes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE# (or CE2#) to VIL, and OE# to VIH.
The device features an Unlock Bypass mode to facil-
itate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are re-
quired to program a word, instead of four. The “Word
Program Command Sequence” section has details on
programming data to the device using both standard
and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sec-
tors, or the entire device. Table 2 indicates the address
space that each sector occupies.
ICC2 in the DC Characteristics table represents the ac-
tive current specification for the write mode. The AC
Characteristics section contains timing specification
tables and timing diagrams for write operations.
Accelerated Program Operation
The device offers accelerated program operations
through the ACC function. This function is primarily in-
tended to allow faster manufacturing throughput dur-
ing system production.
If the system asserts VHH on this pin, the device auto-
matically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sectors,
and uses the higher voltage on the pin to reduce the
time required for program operations. The system
would use a two-cycle program command sequence
as required by the Unlock Bypass mode. Removing
VHH from the ACC pin returns the device to normal op-
eration. Note that the ACC pin must not be at VHH for
operations other than accelerated programming, or
device damage may result.
Autoselect Functions
If the system writes the autoselect command se-
quence, the device enters the autoselect mode. The
system can then read autoselect codes from the inter-
nal register (which is separate from the memory array)
on DQ15–DQ0. Standard read cycle timings apply in
this mode. Refer to the Autoselect Mode and Autose-
lect Command Sequence sections for more informa-
tion.
Standby Mode
When the system is not reading or writing to the de-
vice, it can place the device in the standby mode. In
this mode, current consumption is greatly reduced,
and the outputs are placed in the high impedance
state, independent of the OE# input.
The device enters the CMOS standby mode when the
CE#, CE2#, and RESET# pins are all held at VCC ± 0.3
V. (Note that this is a more restricted voltage range
than VIH.) If CE#, CE2#, and RESET# are held at VIH,
but not within VCC ± 0.3 V, the device will be in the
standby mode, but the standby current will be greater.
The device requires standard access time (tCE) for
read access when the device is in either of these
standby modes, before it is ready to read data.
If the device is deselected during erasure or program-
ming, the device draws active current until the
operation is completed.
ICC3 in the DC Characteristics (for Two Am29LV640
devices) table represents the standby current specifi-
cation.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device en-
ergy consumption. The device automatically enables
this mode when addresses remain stable for tACC +
30 ns. The automatic sleep mode is independent of
the CE#, CE2#, WE#, and OE# control signals. Stan-
dard address access timings provide new data when
addresses are changed. While in sleep mode, output
data is latched and always available to the system.
ICC4 in the DC Characteristics (for Two Am29LV640
devices) table represents the automatic sleep mode
current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of re-
setting the device to reading array data. When the RE-
SET# pin is driven low for at least a period of tRP, the
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET#
pulse. The device also resets the internal state ma-
chine to reading array data. The operation that was in-
terrupted should be reinitiated once the device is
ready to accept another command sequence, to en-
sure data integrity.
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS ± 0.3 V, the de-
vice draws CMOS standby current (ICC4). If RESET# is
held at VIL but not within VSS ± 0.3 V, the standby cur-
rent will be greater.
The RESET# pin may be tied to the system reset cir-
cuitry. A system reset would thus also reset the Flash
10 Am29LV642D
11 Page | ||
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