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DF05430 데이터시트 PDF




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기능 Fast Recovery Diode
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DF05430 데이터시트, 핀배열, 회로
Replaces March 1998 version, DS4215-3.3
DF054
DF054
Fast Recovery Diode
DS4215-4.0 January 2000
APPLICATIONS
s Induction Heating
s A.C. Motor Drives
s Inverters And Choppers
s Welding
s High Frequency Rectification
s UPS
FEATURES
s Double side cooling
s High surge capability
s Low recovery charge
VOLTAGE RATINGS
Type Number
DF054 35
DF054 34
DF054 32
DF054 30
Repetitive Peak
Reverse Voltage
V
RRM
V
3500
3400
3200
3000
Conditions
V = V + 100V
RSM
RRM
KEY PARAMETERS
VRRM
IF(AV)
IFSM
Qr
trr
3500V
1470A
14000A
1200µC
6.0µs
Lower voltage grades available.
CURRENT RATINGS
Symbol
Parameter
Double Side Cooled
IF(AV)
I
F(RMS)
Mean forward current
RMS value
I
F
Continuous (direct) forward current
Single Side Cooled (Anode side)
I
F(AV)
I
F(RMS)
I
F
Mean forward current
RMS value
Continuous (direct) forward current
Outline type code: CB450.
See Package Details for further information.
Conditions
Max. Units
Half wave resistive load, Tcase = 65oC
Tcase = 65oC
T = 65oC
case
Half wave resistive load, T = 65oC
case
Tcase = 65oC
T = 65oC
case
1470
2310
2130
A
A
A
984
1540
1365
A
A
A
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DF05430 pdf, 반도체, 판매, 대치품
DF054
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500
Measured under pulse conditions
400
300
Tj = 150˚C
200
Tj = 25˚C
100
0
0.9 1.0 1.1 1.2
Instantaneous forward voltage VF - (V)
Fig.2 Maximum (limit) forward characteristics
1.3
100000
10000
IF
50µs
QS = 0
tp = 1ms
dIR/dt
QS
IRR
Conditions:
Tj = 150˚C,
VR = 100V
1000
100
1
A
B
C
D
E
A: IF = 2000A
B: IF = 1000A
C: IF = 500A
D: IF = 200A
E: IF = 100A
10 100
Rate of rise of reverse current dIR/dt - (A/µs)
1000
Fig.3 Recovered charge

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DF05430 전자부품, 판매, 대치품
DF054
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-
loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4215-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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