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DAP222 데이터시트 PDF




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기능 Common Anode Silicon Dual Switching Diodes
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DAP222 데이터시트, 핀배열, 회로
www.DataSheet4U.com
DAP222, DAP202U
Preferred Device
Common Anode Silicon
Dual Switching Diodes
These Common Anode Silicon Epitaxial Planar Dual Diodes are
designed for use in ultra high speed switching applications. The
DAP222 device is housed in the SC−75/SOT−416 package which is
designed for low power surface mount applications, where board
space is at a premium. The DAP202U device is housed in the
SC−70/SOT−323 package.
Features
Fast trr
Low CD
Pb−Free Packages are Available
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current
VR
VRM
IF
IFM
IFSM(1)
80
80
100
300
2.0
Vdc
Vdc
mAdc
mAdc
Adc
THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Power Dissipation
PD 150 mW
Junction Temperature
TJ 150 °C
Storage Temperature
Tstg −55 ~ + 150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 5
1
http://onsemi.com
ANODE
3
12
CATHODE
MARKING
DIAGRAMS
3
2
1
SC−75
CASE 463
STYLE 4
P9 M G
G
1
3
1
2
SC−70
CASE 419
NB M G
G
1
P9, NB = Device Codes
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or orientation may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
DAP222
DAP222G
SC−75
SC−75
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
DAP202U
SC−70 3000 / Tape & Reel
DAP202UG
SC−70 3000 / Tape & Reel
(Pb−Free)
DAP222T1
SC−75 3000 / Tape & Reel
DAP222T1G
SC−75
3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
DAP222/D




DAP222 pdf, 반도체, 판매, 대치품
DAP222, DAP202U
PACKAGE DIMENSIONS
SC−75 (SOT−416)
CASE 463−01
ISSUE F
b 3 PL
0.20 (0.008) M D
−E−
2
3
1
e −D−
HE 0.20 (0.008) E
C
A
L A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.70 0.80 0.90 0.027 0.031 0.035
A1 0.00 0.05 0.10 0.000 0.002 0.004
b 0.15 0.20 0.30 0.006 0.008 0.012
C 0.10 0.15 0.25 0.004 0.006 0.010
D 1.55 1.60 1.65 0.059 0.063 0.067
E 0.70 0.80 0.90 0.027 0.031 0.035
e 1.00 BSC
0.04 BSC
L 0.10 0.15 0.20 0.004 0.006 0.008
HE 1.50 1.60 1.70 0.061 0.063 0.065
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ mm Ǔ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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