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Número de pieza | CXA1315 | |
Descripción | 8-bit D/A Converter Supporting with I2C Bus | |
Fabricantes | Sony Corporation | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CXA1315 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
No Preview Available ! CXA1315M/P
8-bit D/A Converter Supporting with I2C Bus
Description
The CXA1315M/P is developed as a 5-channel 8-
bit D/A converter supporting with I2C bus.
Features
• Serial control through I2C bus
• 5-channel 8-bit D/A converter
• Built-in 4general-purpose I/O ports (Digital I/O)
• I/O can be specified to respective ports independently
• Selection of 8 slave addresses possible through
address select pins (3 pins)
Applications
The IC, which cannot support I2C bus, can support
it by connecting its control pin to the CXA1315M/P.
Structure
Bipolar silicon monolithic lC
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltage
VCC 12 V
• Operating temperature Topr –20 to +75 °C
• Storage temperature
Tstg –65 to +150 °C
• Allowable power dissipation PD
960 mW
Operating Conditions
• Supply voltage
• Operating temperature
VCC 8.2 to 9.8 V
Topr –20 to +75 °C
CXA1315M
16 pin SOP (Plastic)
CXA1315P
16 pin DIP (Plastic)
Purchase of Sony's I2C components conveys a license under the Philips I2C Patent Rights to use these components in
an I2C system, provided that the system conforms to the I2C Standard Specifications as defind by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E88Z45D78-PS
1 page Electrical Characteristics Measurement Circuit
Measurement Circuit 1
+9V
0.022µ
I2C BUS
5V
10µ
16 15 14 13 12 11 10 9
CXA1315M/P
1 23 4 5 6 7 8
100p 100p 100p 100p 100p
CXA1315M/P
Measurement Circuit 2
+9V 0.022µ
I2C BUS
10µ
16 15 14 13 12 11 10
9
CXA1315M/P
1 23 4 5 6 7 8
100p 100p 100p 100p 100p
±1mA
Measurement Circuit 3
100Hz, 1Vp-p
+9V 0.022µ
I2C BUS
10µ
16 15 14 13 12 11 10 9
CXA1315M/P
1 23 4 5 6 7 8
100p 100p 100p 100p 100p
Measurement Circuit 4
+9V 0.022µ
I2C BUS
10µ
16 15 14 13 12 11 10 9
CXA1315M/P
1 23 4 5 6 7 8
1.5V (No.8)
V4 = 2.0V (No.9)
0.4V (No.10)
4.5V (No.11)
V4
Measurement Circuit 5
+9V 0.022µ
I2C BUS
10µ
16 15 14 13 12 11 10
9
CXA1315M/P
1 2 3 4 56 78
1mA
–5–
5 Page CXA1315P
16PIN DIP (PLASTIC)
+ 0.4
19.2 – 0.1
16 9
18
2.54
0° to 15°
CXA1315M/P
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
SOLDER PLATING
COPPER ALLOY
1.0 g
16PIN DIP (PLASTIC) 300mil
19.35 ± 0.5
16 9
18
2.54 ± 0.254
1.016
0° to 10°
0.457 ± 0.076
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-191
DIP016-P-0300-AU
MS-001-AA
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER
PACKAGE WEIGHT
1.0g
– 11 –
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet CXA1315.PDF ] |
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