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PDF CXA3199 Data sheet ( Hoja de datos )
| Número de pieza | CXA3199 | |
| Descripción | Wideband Pre-amplifier | |
| Fabricantes | Sony Corporation | |
| Logotipo |  |
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Wideband Pre-amplifier
CXA3199TN
Description
The CXA3199TN is a wideband Pre-amplifier for
VTR head.
10 pin TSSOP (Plastic)
Features
• Operate on single +3.3 V power supply
• Low power consumption
Read : 45 mW
• Ultra small package
• Wideband (–3 dB) : 140 MHz (typ)
• Read amplifier emitter follower output featuring
380 times gain (typ).
• Low input capacitance : 3.0 pF
• Low input noise : 0.65 nV /√ Hz
• Read data outputs are high impedance in Power
Saving Mode
Structure
Bipolar silicon monolithic IC
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VCC 6 V
• Operating temperature Topr –20 to +70 °C
• Storage temperature Tstg –55 to +150 °C
• Allowable power dissipation (on board)
PD 1000 mW
Operating Conditions
Supply voltage
VCC
3.1 to 5.5
V
Block Diagram and Pin Configuration
VCC 1
NC 2
HX 3
HY 4
GND 5
AMP
10 CE
9 XCE
8 RDX
7 RDY
6 GND
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E98221-TE
1 page  
Timing Chart
CXA3199TN
XCE
CE
RDX
RDY
90%
TIR
Description of Functions
Pre-amplifier
This is a low noise amplifier for amplifying the signals from the heads with an emitter follower output.
The RDX and RDY are the outputs of the differential amplifier whose polarity between the RDX and X side of
the head input is same.
Mode control
The mode are set as shown Table 1 by CE and XCE.
CE XCE
HL
HH
LL
LH
Mode
Read
Power saving
Table 1. Mode selection
—5—
5 Page 
Package Outline Unit : mm
CXA3199TN
10PIN TSSOP(PLASTIC)
∗2.8 ± 0.1
10 6
1.2MAX
0.1
+ 0.15
0.1 – 0.05
1
+ 0.08
0.22 – 0.07
5
0.5
0.1 M
0.25
0° to 10°
A
(0.2)
+ 0.08
0.22 – 0.07
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSSOP-10P-L01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
—11—
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet CXA3199.PDF ] | |
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