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부품번호 M1MA151AT1 기능
기능 SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT
제조업체 Motorola Inc
로고 Motorola  Inc 로고


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M1MA151AT1 데이터시트, 핀배열, 회로
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Single Silicon Switching Diodes
These Silicon Epitaxial Planar Diodes are designed for use in ultra high speed
switching applications. These devices are housed in the SC–59 package which is
designed for low power surface mount applications.
Fast trr, < 3.0 ns
Low CD, < 2.0 pF
Available in 8 mm Tape and Reel
Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.
ANODE
3
Order this document
by M1MA151AT1/D
M1MA151AT1
M1MA152AT1
Motorola Preferred Devices
SC–59 PACKAGE
SINGLE SILICON
SWITCHING DIODES
40/80 V–100 mA
SURFACE MOUNT
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
21
CATHODE NO CONNECTION
Value
Unit
Reverse Voltage
M1MA151AT1
M1MA152AT1
VR
40 Vdc
80
Peak Reverse Voltage
M1MA151AT1
M1MA152AT1
VRM
40 Vdc
80
Forward Current
Peak Forward Current
Peak Forward Surge Current
IF
IFM
IFSM(1)
100 mAdc
225 mAdc
500 mAdc
THERMAL CHARACTERISTICS
Rating
Symbol Max Unit
Power Dissipation
Junction Temperature
Storage Temperature
PD 200 mW
TJ 150 °C
Tstg
– 55 to + 150
°C
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Condition
Reverse Voltage Leakage Current
Forward Voltage
Reverse Breakdown Voltage
M1MA151AT1
M1MA152AT1
M1MA151AT1
M1MA152AT1
IR
VF
VR
VR = 35 V
VR = 75 V
IF = 100 mA
IR = 100 µA
Diode Capacitance
Reverse Recovery Time
1. t = 1 SEC
2. trr Test Circuit
CD
trr(2)
VR = 0, f = 1.0 MHz
IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
©MMoototorroollaa, ISncm. 1a9l9l–6Signal Transistors, FETs and Diodes Device Data
3
2
1
CASE 318D–03, STYLE 4
SC–59
Min Max Unit
— 0.1 µAdc
— 0.1
— 1.2 Vdc
40 — Vdc
80 —
— 2.0 pF
— 3.0 ns
1




M1MA151AT1 pdf, 반도체, 판매, 대치품
M1MA151AT1 M1MA152AT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SC–59 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 1 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
STEP 1 STEP 2 STEP 3
STEP 4
STEP 5 STEP 6 STEP 7
PREHEAT VENT HEATING
HEATING HEATING VENT COOLING
ZONE 1
“RAMP”
“SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7
“RAMP”
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
205° TO 219°C
PEAK AT
SOLDER JOINT
150°C
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

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M1MA151AT1

SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT

Motorola  Inc
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M1MA151AT1

SINGLE SILICON SWITCHING DIODES

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