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FH16P-64S-0.5SHW 데이터시트 PDF




Hirose Electric에서 제조한 전자 부품 FH16P-64S-0.5SHW은 전자 산업 및 응용 분야에서
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부품번호 FH16P-64S-0.5SHW 기능
기능 High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch)
제조업체 Hirose Electric
로고 Hirose Electric 로고


FH16P-64S-0.5SHW 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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FH16P-64S-0.5SHW 데이터시트, 핀배열, 회로
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch)
FH16 Series
FH16 Series Variation
0.3mm pitch 60 contact
0.3mm pitch 80 contact
0.3mm pitch 90 contact
0.4mm pitch 80 contact
0.5mm pitch 50 contact
0.5mm pitch 64 contact
sFeatures
1. High Density FPC Connector
The FH16 series is a fine pitch, zero insertion force (ZIF), right angle, bottom
contact, connector compatible with flexible printed circuits (FPC) with a pitch
of 0.3mm, 0.4mm, and 0.5mm and a recommended thickness of 0.295mm for
single-sided or 0.306mm for double-sided. The FH16 provides a higher pin
count given the same amount of board space than other manufacturers of
similar product. With a large selection in pin density, the FH16 series greatly
improves design flexibility.
FH16 : 0.3mm pitch 60, 80, and 90 contacts
FH16M : 0.4mm pitch 80 and 96 contacts
FH16H : 0.5mm pitch 50 contacts
FH16P : 0.5mm pitch 64 contacts
[Conventional product (FH12 series)]
0.5mm pitch 30 contact
Excellent Serviceability with Flip-Lock Design
Flip-lock type
2. Easy mounting on PCB
FH16 supports 0.3mm pitch cable but only requires a 0.6mm pitch pad
layout on the PCB. The FH16’s staggered pin design allows the
mounting lead area to be twice as wide as the FPC contact area making
it easier to place the connector on the board given the fine pitch of the
contacts.
3. User Friendly Flip-Lock Design
The flip-lock (one-touch rotating type) ZIF structure secures the FPC
connection with a single and light force. This design helps simplify
assembly and repair work. When locking the FPC, the audible click
assures the assembly worker of a steady FPC connection resulting in
improved customer service.
Mechanism to prevent
FPC from escape and oblique
mating
4. Prevents FPC from escape and oblique mating
The FH16 series with its recommended FPC dimensions prevents the
FPC from escape and oblique mating thereby securing a steady
connection.
5. Compatible with Automatic Assembly Tooling
Embossed tape packaging allows for automatic placement onto the PCB.
sApplications
Notebook computers, printers, PDAs, digital cameras and other compact devices for interconnecting the main circuit board with the
LCD,PDP(Plasma Display),HDD or other device.
Hard
Disk-Drive
PCB
Notebook PC
PDP
PCB
HDD
PCB
66




FH16P-64S-0.5SHW pdf, 반도체, 판매, 대치품
sConnector Dimensions
A
B
QC
R 0.12
Mark
10
R 0.12
D
Suction Parts for Automatic Mounting
E 6.6
FPC Conductive Surface
7.4
Part Number
FH16-60S-0.3SHW
FH16-80S-0.3SHW
FH16-90S-0.3SHW
CL No.
586-0620-2
586-0613-7
586-0697-7
Number of FPC
contacts Contact Pitch
60 0.3
80 0.3
90 0.3
FH16M-80S-0.4SHW
FH16M-96S-0.4SHW
FH16H-50S-0.5SHW
FH16P-64S-0.5SHW
586-0675-4
586-0715-7
586-0676-7
586-0649-4
80
96
50
64
0.4
0.4
0.5
0.5
NOTE: Embossed tape reel packaging (1,000 pieces/reel).
Order by number of reels.
A
21.9
27.9
30.9
36.1
42.5
29.4
36.0
B
17.7
23.7
26.7
31.6
38.0
24.5
31.5
C
17.4
23.4
26.4
31.2
37.6
24.0
31.0
D
17.4
23.4
26.4
31.2
37.6
24.0
31.0
E
18.35
24.35
27.35
32.25
38.65
25.55
32.15
Unit: mm
QR
0.3 0.6
0.3 0.6
0.3 0.6
0.4 0.8
0.4 0.8
0.5 1.0
0.5 1.0
69

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FH16P-64S-0.5SHW 전자부품, 판매, 대치품
BRecommended Temperature Profile
5 sec. max.
250
240ç
200 200ç
160ç
150 150ç
100
50
25ç
(60 sec.)
60 to 90 sec.
(30 sec.)
(20 to 30 sec.)
0
Start
60 Preheating 120
Soldering 180
Time (sec.)
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-2)
Environment
:Room air
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s
Part Number: OZ63-201C-50-9)
Test board
:Glass epoxy 45mm∞80mm∞1.6mm thick
Land dimensions :Contact Pitch 0.3mm, 0.4mm
0.3mm∞1.7mm
Contact Pitch 0.5mm
0.6mm∞1.7mm
Metal mask
:Contact Pitch 0.3mm, 0.4mm
0.25mm∞1.7mm∞0.15mm thick
Contact Pitch 0.5mm
0.5mm∞1.7mm∞0.15mm thick
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
72

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관련 데이터시트

부품번호상세설명 및 기능제조사
FH16P-64S-0.5SHW

High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch)

Hirose Electric
Hirose Electric

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