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PDF FODB100 Data sheet ( Hoja de datos )
| Número de pieza | FODB100 | |
| Descripción | SINGLE CHANNEL MICROCOUPLER | |
| Fabricantes | Fairchild Semiconductor | |
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SINGLE CHANNEL MICROCOUPLER™
FODB100
FODB101
DESCRIPTION
The FODB100, FODB101 and FODB102 single channel MICROCOUPLERS™ are all
Pb-free, low profile miniature surface mount optocouplers in a Ball Grid Array (BGA)
package. Each consists of an aluminum gallium arsenide (AlGaAs) infrared emitting diode
driving a silicon phototransistor.
FEATURES
• Low profile package
(1.20mm maximum mounted height)
• Land pattern allows for optimum board space savings
• High Current Transfer Ratio (CTR) at low IF
• Minimum isolation distance of 0.45mm
• High steady state isolation voltage of 2500Vrms
• Data rates up to 120Kbit/s (NRZ)
• Minimum creepage distance of 2mm
• Wide operating temperature range of -40°C to +125°C
• Available in tape and reel quantities of 3000 units
• Applicable to Pb-free Infrared Ray reflow (260°C max)
• UL, C-UL approved; VDE pending
APPLICATIONS
• Primarily suited for DC-DC converters
• For ground loop isolation, signal to noise isolation
Communications – chargers, adapters
Consumer – appliances, set top boxes
Industrial – power supplies, motor control
FODB102
SCHEMATIC
ANODE 1
CATHODE 2
4 COLLECTOR
3 EMITTER
2.50
12
PACKAGE DIMENSIONS
3.50 ± 0.10
A
43
B
0.65 MAX
2.50
3.50 ± 0.10
BALL #1
INDICATOR
43
BOTTOM VIEW
Ø
0.98
0.80
MAX
MIN
12
TOP VIEW
0.10 C B A
(Ø2.30)
0.35 MAX
0.25 MIN
1.20 MAX
C
SEATING
PLANE
0.85 MAX
0.68 MIN
0.10 C
NOTES: UNLESS OTHERWISE SPECIFIED
A) ALL DIMENSIONS ARE IN MILLIMETERS.
B) NO JEDEC REGISTRATION REFERENCE AS
OF NOVEMBER 2002.
© 2004 Fairchild Semiconductor Corporation
Page 1 of 8
8/19/04
1 page  
SINGLE CHANNEL MICROCOUPLER™
FODB100
FODB101
FODB102
TAPE AND REEL SPECIFICATIONS
Embossed Carrier Tape Configuration
P0
T
D0
K0 Wc
B0
Tc
A0 P1 D1
User Direction of Feed
E1
F
E2
W
Dimensions are in millimeter
Pkg type
A0
Optocoupler 3.80
(12mm)
±0.10
B0
3.80
±0.10
W
12.0
+0.3/
–0.1
D0
1.50
+0.25/
–0.00
D1
1.50
+0.25/
–0.00
E1
1.75
±0.10
E2
10.25
min
F P1
5.50
±0.05
8.0
±0.1
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum
Typical
component
cavity
B0 center line
20 deg maximum component rotation
Sketch A (Side or Front Sectional View)
Component Rotation
Optocoupler Reel Configuration
Typical
component
center line
A0
Sketch B (Top View)
Component Rotation
W1 Measured at Hub
P0
4.0
±0.1
K0
1.40
±0.10
T
0.279
±0.02
Wc Tc
9.2
±0.3
0.06
±0.02
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Dim A
max
Dim N
Dim D
min
B Min
Dim C
DETAIL AA
13"Diameter Reel
See detail AA
W3
W2 max Measured at Hub
Tape Size
12mm
Reel
Option
13" Dia
Dim A Dim B
13.00
330
0.059
1.5
Dimension are in inches and millimeters
Dim C
Dim D
512 +0.020/–0.008 0.795
13 +0.5/–0.2
20.2
Dim N
7.00
178
Dim W1
Dim W2
0.488 +0.078/–0.000 0.724
12.4 +2/–0
18.4
Dim W3 (LSL–USL)
0.469 – 0.606
11.9 – 15.4
© 2004 Fairchild Semiconductor Corporation
Page 5 of 8
8/19/04
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet FODB100.PDF ] | |
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