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PDF DTC114YE Data sheet ( Hoja de datos )
| Número de pieza | DTC114YE | |
| Descripción | CASE 463-01/ STYLE 1 SOT-416/SC-90 | |
| Fabricantes | Motorola Inc | |
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Hay una vista previa y un enlace de descarga de DTC114YE (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by DTC114YE/D
Preliminary Data Sheet
Bias Resistor Transistor
NPN Silicon Surface Mount Transistor with
Monolithic Bias Resistor Network
DTC114YE
3
The BRT (Bias Resistor Transistor) contains a single transistor with a
monolithic bias network consisting of two resistors; a series base resistor and a
base–emitter resistor. These digital transistors are designed to replace a single
device and its external resistor bias network. The BRT eliminates these
individual components by integrating them into a single device. The DTC114YE
is housed in the SOT–416/SC–90 package which is ideal for low power surface
mount applications where board space is at a premium.
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel.
2
1
CASE 463–01, STYLE 1
SOT–416/SC–90
IN (1)
R1
R2
R1 = 10 kΩ
R2 = 47 kΩ
OUT (3)
GND (2)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Output Voltage
Input Voltage
Output Current
DEVICE MARKING
VO 50
VI 40
IO 100
DTC114YE = 69
THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25°C(1)
Operating and Storage Temperature Range
Junction Temperature
PD
TJ, Tstg
TJ
*125
– 55 to +150
150
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Min
Typ
Max
Input Off Voltage (VO = 5.0 Vdc, IO = 100 µAdc)
VI(off)
—
—
Input On Voltage (VO = 0.3 Vdc, IO = 1.0 mAdc)
VI(on)
1.4
—
Output On Voltage (IO = 5.0 mAdc, II = 0.25 mAdc)
VO(on)
—
—
Input Current (VI = 5.0 Vdc)
II — —
Output Cutoff Current (VO = 50 Vdc)
IO(off)
—
—
DC Current Gain (VO = 5.0 Vdc, IO = 5.0 mAdc)
GI 68 —
Input Resistance
R1 7.0 10
Resistance Ratio
R1/R2 0.17 0.21
1. Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint.
0.3
—
0.3
0.88
500
—
13
0.25
Unit
Vdc
Vdc
mAdc
mW
°C
°C
Unit
Vdc
Vdc
Vdc
mAdc
nAdc
—
kOhms
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Thermal Clad is a trademark of the Bergquist Company
REV 1
©MMoototorroollaa, ISncm. 1a9l9l–6Signal Transistors, FETs and Diodes Device Data
1
1 page  
DTC114YE
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 9 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 9. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet DTC114YE.PDF ] | |
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