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KH232 데이터시트 PDF




Fairchild Semiconductor에서 제조한 전자 부품 KH232은 전자 산업 및 응용 분야에서
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부품번호 KH232 기능
기능 Low Distortion Wideband Op Amp
제조업체 Fairchild Semiconductor
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KH232 데이터시트, 핀배열, 회로
KH232
Low Distortion Wideband Op Amp
www.fairchildsemi.com
Features
s -69dBc 2nd and 3rd harmonics at 20MHz
s -3dB bandwidth of 270MHz
s 0.05% settling in 15ns
s 3000V/µs slew rate
s 1mV input offset voltage, 10µV/°C drift
s ±10V, 100mA max output
s Direct replacement for CLC232
Applications
s Flash A/D drivers
s DAC current-to-voltage conversion
s Wide dynamic range IF amps
s VCO drivers
s DDS postamps
s Radar/communication receivers
s Precision line drivers
Bottom View
ICC Adjust
Case
ground
GND Adjust -VCC
Supply
Voltage
Non-Inverting
Input
7
V+ 6
89
-VCC
10
Collector
Supply
Inverting
Input
V- 5
+
-
4
4 11 Vo
Output
Not
Connected
NC 4
3
12
+VCC
21
Case
ground
GND Adjust +VCC
ICC Adjust
Supply
Voltage
Collector
Supply
Pins 2 and 8 are used to adjust the sup-
ply current or to adjust the offset voltage
(see text). These pins are normally left
unconnected.
General Description
The KH232 is a wideband low distortion operational
amplifier designed specifically for high speed, low gain
applications requiring wide dynamic range. Utilizing a
current feedback architecture, the KH232 offers high
speed performance while maintaining DC precision.
The KH232 offers precise gains from ±1 to ±5 with a
true 0.1% linearity and provides stable, oscillation-
free operation across the entire gain range without
external compensation. The KH232, a pin compatible
enhanced version of the KH231, reduces 2nd and 3rd
harmonic distortion to an extremely low -69dBc at
20MHz (2Vpp, RL = 100). Additional features provided
by the KH232 include a small signal bandwidth of
270MHz, a large signal bandwidth of 95MHz and a
3000V/µs slew rate. The input offset voltage is typically
1mV with an input offset drift of 10µV/°C.
The KH232 combines these high performance features
with its 0.05% settling time of 15ns and its 100mA
drive capability to provide high speed, high resolution
A/D and D/A converter systems with an attractive
solution for driving and buffering. Wide dynamic
range systems such as radar and communication
receivers requiring low harmonic distortion and low
noise will find the KH232 to be an excellent choice. As
a line driver, the KH232 set at a gain of 2 cancels
matched line losses.
The KH232 is constructed using thin film resistor/bipolar
transistor technology, and is available in the following
versions:
KH232AI
KH232AK
KH232AM
-25°C to +85°C
-55°C to +125°C
-55°C to +125°C
KH232HXC -55°C to +125°C
KH232HXA -55°C to +125°C
12-pin TO-8 can
12-pin TO-8 can, features
burn-in & hermetic testing
12-pin TO-8 can,
environmentally
screened and electrically
tested to MIL-STD-883
SMD#: 5962-9166501HXC
SMD#: 5962-9166501HXA
Typical Performance
Gain Setting
Parameter
1 2 5 -1 -2 -5
-3dB bandwidth
430 270 135 220 175 110
rise time (2V)
1.8 2.0 2.5 2.0 2.2 2.9
slew rate
2.5 3.0 3.0 3.0 3.0 3.0
settling time (to 0.1%) 12 12 12 12 12 15
Units
MHz
ns
V/ns
ns
REV. 1A February 2001




KH232 pdf, 반도체, 판매, 대치품
DATA SHEET
KH232
Operation
The KH232 is based on the current feedback op amp
topology, a design that uses current feedback instead of
the usual voltage feedback.
The use of the KH232 is basically the same as that of the
conventional op amp (see Figures 1 and 2). Since the
device is designed specifically for low gain applications,
the best performance is obtained when the circuit is used
at gains between ±1 and ±5. Additionally, performance is
optimum when a 250feedback resistor is used.
+15V
3.9
Vin
Ri
49.9
33
0.1 .01
Capactance in µF
6
1
+
12
Rg
KH232 11
5-
10
3,7
250
9
Vo
RL
100
-15V
33
3.9 0.1
.01
Av
=
1+
Rf
Rg
Rf = 250
Figure 1: Recommended non-inverting gain circuit
+15V
33
3.9 0.1
.01
100
Vin
Ri
Rg
6
1
+
12
KH232 11
5-
10
3,7
9
Capactance in µF
250
Vo
RL
100
-15V
33
3.9 0.1
Av
=
Rf
 Rg

.01 Rf = 250
For Zin = 50, select
Rg || Ri = 50
Figure 2: Recommended inverting gain circuit
Layout Considerations
To assure optimum performance the user should follow
good layout practices which minimize the unwanted
coupling of signals between nodes. During initial bread-
boarding of the circuit use direct point to point wiring,
keeping the lead lengths to less than 0.25. The use of
solid, unbroken ground plane is helpful. Avoid wire-wrap
type pc boards and methods. Sockets with small, short
pin receptacles may be used with minimal performance
degradation although their use is not recommended.
During pc board layout keep all traces short and direct
The resistive body of Rg should be as close as possible
to pin 5 to minimize capacitance at that point. For the
same reason, remove ground plane from the vicinity of
pins 5 and 6. In other areas, use as much ground plane
as possible on one side of the board. It is especially
important to provide a ground return path for current from
the load resistor to the power supply bypass capacitors.
Ceramic capacitors of 0.01 to 0.1µf (with short leads)
should be less than 0.15 inches from pins 1 and 9.
Larger tantalum capacitors should be placed within one
inch of these pins. VCC connections to pins 10 and 12
can be made directly from pins 9 and 1, but better supply
rejection and settling time are obtained if they are
separately bypassed as in figures 1 and 2. To prevent
signal distortion caused by reflections from impedance
mismatches, use terminated microstrip or coaxial cable
when the signal must traverse more than a few inches.
Since the pc board forms such an important part of the
circuit, much time can be saved if prototype boards of any
high frequency sections are built and tested early in the
design phase. Evaluation boards designed for either
inverting or non-inverting gains are available.
Offset Voltage Adjustment
If trimming of the input offset voltage (Vos = Vni -Vin) is
desired, a resistor value of 10kto 1Mplaced between
pins 8 and 9 will cause Vos to become more negative by
8mV to 0.2mV respectively. Similarly, a resistor placed
between pins 1 and 2 will cause Vos, to become more
positive.
Thermal Considerations
At high ambient temperatures or large internal power
dissipations, heat sinking is required to maintain
acceptable junction temperatures. Use the thermal
model on the previous page to determine junction
temperatures. Many styles of heat sinks are available for
TO-8 packages; the Thermalloy 2240 and 2268 are good
examples. Some heat sinks are the radial fin type which
cover the pc board and may interfere with external
components. An excellent solution to this problem is to
use surface mounted resistors and capacitors. They
have a very low profile and actually improve high
frequency performance. For use of these heat sinks with
conventional components, a 0.1high spacer can be inserted
under the TO-8 package to allow sufficient clearance.
4 REV. 1A February 2001

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