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PDF ILX523A Data sheet ( Hoja de datos )

Número de pieza ILX523A
Descripción 2700 pixel CCD Linear Sensor (B/W)
Fabricantes Sony Corporation 
Logotipo Sony Corporation Logotipo



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2700 pixel CCD Linear Sensor (B/W)
ILX523A
Description
The ILX523A is a reduction type CCD linear sensor
designed for facsimile, scanner and OCR use. This
sensor reads A3 size documents at a density of 200
DPI (Dot Per Inch).
In addition, this can be directly driven at 5V logic
and operate on single 12V power supply for easy
use.
22 pin DIP (Cer-DIP)
Features
Number of effective pixels: 2700 pixels
Pixel size:
11µm × 11µm (11µm pitch)
Ultra low lag/High Sensitivity
Built-in Feed through suppression circuit
Built-in Sample-and-hold circuit
Maximum data rate: 5MHz
Single 12V power supply
Block Diagram
Absolute Maximum Ratings
Supply voltage
VDD 15
Operating temperature
–10 to +60
Storage temperature
–30 to +80
V
°C
°C
Pin Configuration (Top View)
VOUT 1
VSS 2
NC 3
φS/H 4
NC 5
NC 6
NC 7
NC 8
φ1 9
NC 10
φROG 11
1
2700
22 NC
21 NC
20 VDD
19 T1
18 φRS
17 NC
16 NC
15 NC
14 φ2
13 NC
12 NC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E97442A78

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ILX523A pdf
ILX523A
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ILX523A arduino
ILX523A
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing Cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of
the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Upper ceramic layer 39N
29N
29N
0.9Nm
Low-melting glass
Lower ceramic layer (1)
(2)
(3)
(4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
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