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What is K9K2G08U0M?

This electronic component, produced by the manufacturer "Samsung semiconductor", performs the same function as "256M x 8 Bit / 128M x 16 Bit NAND Flash Memory".


K9K2G08U0M Datasheet PDF - Samsung semiconductor

Part Number K9K2G08U0M
Description 256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
Manufacturers Samsung semiconductor 
Logo Samsung semiconductor Logo 


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K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0 K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0 K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
Document Title
256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
Revision History
Revision No History
0.0 1. Initial issue
0.1 1. IOL(R/B) of 1.8V device is changed.
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
Draft Date Remark
Sep. 19.2001 Advance
Nov. 5. 2001
0.2 1. 5th cycle of ID is changed
: 40h --> 44h
Jan. 23.2002
0.3 1. Add WSOP Package Dimensions.
May. 29.2002
0.4 1. Max Icc value of 1.8V/3.3V device is changed.
- Max. value Icc1,Icc2,Icc3: 20mA --> 30mA (3.3V device)
- Max. value Icc1,Icc2,Icc3: 15mA --> 20mA (1.8V device)
0.5 1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 35)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 36)
The min. Vcc value 1.8V devices is changed.
0.6 K9K2GXXQ0M : Vcc 1.65V~1.95V --> 1.70V~1.95V
0.7 Pb-free Package is added.
K9K2G08U0M-FCB0,FIB0
K9K2G08Q0M-PCB0,PIB0
K9K2G08U0M-PCB0,PIB0
K9K2G16U0M-PCB0,PIB0
K9K2G16Q0M-PCB0,PIB0
0.8 Errata is added.(Front Page)-K9K2GXXQ0M
tWC tWP tWH tRC tREH tRP tREA tCEA
Specification 45 25 15 50 15 25 30 45
Relaxed value 80 60 20 60 80 60 60 75
1. The 3rd Byte ID after 90h ID read command is don’t cared.
0.9 The 5th Byte ID after 90h ID read command is deleted.
1.0 1. Added Addressing method for program operation
Sep. 12.2002
Nov. 22.2002
Mar. 6.2003
Mar. 13.2003
Mar. 17.2003
Apr. 9. 2003
Jan. 27. 2004
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
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K9K2G08U0M equivalent
K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0 K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0 K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
PIN CONFIGURATION (WSOP1)
K9K2G08U0M-VCB0,FCB0/VIB0,FIB0
N.C
N.C
DNU
N.C
N.C
N.C
R/B
RE
CE
DNU
N.C
Vcc
Vss
N.C
DNU
CLE
ALE
WE
WP
N.C
N.C
DNU
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48 N.C
47 N.C
46 DNU
45 N.C
44 I/O7
43 I/O6
42 I/O5
41 I/O4
40 N.C
39 DNU
38 N.C
37 Vcc
36 Vss
35 N.C
34 DNU
33 N.C
32 I/O3
31 I/O2
30 I/O1
29 I/O0
28 N.C
27 DNU
26 N.C
25 N.C
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F
Unit :mm
15.40±0.10
#1
0.70 MAX
0.58±0.04
#48
#24 #25
(0.01Min)
17.00±0.20
5
0.45~0.75


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On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for K9K2G08U0M electronic component.


Information Total 30 Pages
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Featured Datasheets

Part NumberDescriptionMFRS
K9K2G08U0AThe function is FLASH MEMORY. Samsung semiconductorSamsung semiconductor
K9K2G08U0MThe function is 256M x 8 Bit / 128M x 16 Bit NAND Flash Memory. Samsung semiconductorSamsung semiconductor
K9K2G08U0M-FThe function is 256M x 8 Bit / 128M x 16 Bit NAND Flash Memory. Samsung semiconductorSamsung semiconductor

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