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F0118J 데이터시트 PDF




OSRAM에서 제조한 전자 부품 F0118J은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 F0118J 자료 제공

부품번호 F0118J 기능
기능 GaAs Infrared Emitting Diode
제조업체 OSRAM
로고 OSRAM 로고


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F0118J 데이터시트, 핀배열, 회로
GaAs-Infrarot-Lumineszenzdiode (950 nm, 300 µm Kantenlänge)
GaAs Infrared Emitting Diode(950 nm, 12 mil)
F 0118J
Vorläufige Daten / Preliminary data
Wesentliche Merkmale
• Typ. Gesamtleistung: 22 mW @ 100 mA im
Topled® Gehäuse.
Chipgröße 300 x 300 µm2
GaAlAs-LED mit sehr hohem Wirkungsgrad
Hohe Zuverlässigkeit
Hohe Impulsbelastbarkeit
Gute spektrale Anpassung an
Si-Fotoempfänger
Vorderseitenmetallisierung: Aluminium
Rückseitenmetallisierung: Goldlegierung
Anwendungen
IIR-Fernsteuerung von Fernseh-, Rundfunk-
und Videogeräten, Lichtdimmern
Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
Lichtschranken bis 500 kHz
Sensorik
Features
Typ. total radiant power: 22 mW @ 100 mA in
Topled® package.
Chip size 300 x 300 µm2
Very highly efficient GaAlAs LED
High reliability
High pulse handling capability
Good spectral match to silicon
photodetectors
Frontside metallization: aluminum
Backside metallization: gold alloy
Applications
IR remote control for hifi and TV sets, video
tape recorder, dimmers
Remote control for steady and varying
intensity
Light-reflection switches (max. 500 kHz)
Sensor technology
Typ
Type
F 0118J
Bestellnummer
Ordering Code
Q67220-C1350
Beschreibung
Description
Infrarot emittierender Chip, Oberseite Anodenanschluss
Rückseite AuGe Eutektikum
Infrared emitting die, top side anode connection
Backside AuGe eutectic alloy
2002-02-21
1




F0118J pdf, 반도체, 판매, 대치품
fj
Grenzwert3) ( gemessen auf TO18-Bodenplatte ohne Verguss, TA = 25°C)
Maximum Ratings3) (measured on TO18 header without resign, TA = 25°C)
Bezeichnung
Symbol
Wert
Parameter
Symbol
Value
Maximaler Betriebstemperaturbereich
Maximum operating temperature range
Top
- 40...+100
Maximaler Lagertemperaturbereich
Tstg - 40...+100
Maximum storage temperature range
Maximaler Durchlaßstrom
Maximum forward current
IF 100
Maximaler Stoßstrom
Maximum surge current
IS 3
Maximale Sperrschichttemperatur
Maximum junction temperature
Tj 125
F 0118J
Einheit
Unit
°C
°C
mA
A
°C
2002-02-21
4

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F0118J 전자부품, 판매, 대치품
F 0118J
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information generally describes the type of component and shall not be considered as assured characteristics or
detailed specification.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our sales organization.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized by us for such purpose!
Critical components5), may only be used in life-support devices or systems6) with the express written approval of
OSRAM OS.
1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value. For final electrical testing a spot check with sufficient statistical accuracy is carried out.
Minimum and maximum values( refered to as min. and max.) refer to the limits of the sample measurement.
2) Based on data measured in OSRAM Opto Semiconductors TOPLED® package. They represent typical1) data.
3) Maximum ratings are strongly package dependent and may differ between different packages. The values given
represent the chip in an OSRAM OS TOPLED® package and are only valid for this package.
4) Value is referenced to the vendors measurement system (correlation to customer product(s) is required).
5)A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
6)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2002-02-21
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