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PDF TSS461 Data sheet ( Hoja de datos )

Número de pieza TSS461
Descripción Van Controller Serial Interface
Fabricantes TEMIC Semiconductors 
Logotipo TEMIC Semiconductors Logotipo



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No Preview Available ! TSS461 Hoja de datos, Descripción, Manual

Qualpack TSS463 / TSS461C
TSS463 VAN
Van Controller Serial Interface
TSS461C VAN
Van Controller
TSS463/TSS461C
VAN Controllers
1999 January
TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY
Rev. 2 – January 1999
1

1 page




TSS461 pdf
3.2 Product Design
Die size (TSS463)
Die size (TSS461C)
Logic Effective channel length
Gate poly width
Gate poly spacing
Metal 1 width
Metal 1 spacing
Metal 2 width
Metal 2 spacing
Contact size
Via size
Qualpack TSS463 / TSS461C
11.15mm2 (3610µm*3280µm)
8.46mm2 (3480µm*2610µm)
0.8µm
0.8µm
1.2µm
1.3um
1.5um
1.6um
1.6um
1.0µm
1.4µm
Rev. 2 – January 1999
5

5 Page





TSS461 arduino
Qualpack TSS463 / TSS461C
4.1 Change Procedure
All changes are controlled by ECN (Engineering Change Notice). All major changes are notified to those
customers using products which are affected by the change.
A major change is defined as a change which affects the electrical and/or mechanical specification as
defined in the datasheet or which affects the following parameters as defined hereafter:
1 General Major Changes
1-1 Manufacturing line
1-2 Sequence of fabrication process cycle
1-3 Material
1-4 Electrical parameter
1-5 Dimension
1-6 Pad location
1-7 Die size
2 Changes specific to wafer fabrication area
2-1 Doping process
2-2 Gate oxide formation method
2-3 Equipement change
2-4 Layer thickness
2-5 Module dimensions
3 Changes specific to to assembly process area
3-1 Sawing process
3-2 Die attach process
3-3 Wire interconnect method
3-4 Molding process
3-5 Tinning process
4 Changes specific to test area
4-1 Specification limit
4-2 Test coverage reduction
4-3 Product identification
4-4 Final conditioning
Rev. 2 – January 1999
11

11 Page







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