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PDF TZA3033 Data sheet ( Hoja de datos )
| Número de pieza | TZA3033 | |
| Descripción | SDH/SONET STM1/OC3 and STM4/OC12 transceiver | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TZA3033
SDH/SONET STM1/OC3
transimpedance amplifier
Objective specification
File under Integrated Circuits, IC19
1998 Jul 08
1 page  
Philips Semiconductors
SDH/SONET STM1/OC3 transimpedance amplifier
Objective specification
TZA3033
Pad centre locations
SYMBOL
DREF
TESTA
GND
GND
IPhoto
TESTB
GND
GND
GND
GND
OUT
OUTQ
VCC
VCC
AGC
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
COORDINATES(1)
xy
95 881
95 735
95 618
95 473
95 285
95 147
215 95
360 95
549 95
691 95
785 501
785 641
567 1055
424 1055
259 1055
Note
1. All coordinates (µm) are measured with respect to the
bottom left-hand corner of the die.
FUNCTIONAL DESCRIPTION
The TZA3033 is a transimpedance amplifier intended for
use in fibre optic links for signal recovery in STM1/OC3
applications. It amplifies the current generated by a photo
detector (PIN diode or avalanche photodiode) and
transforms it into a differential output voltage. The most
important characteristics of the TZA3033 are high receiver
sensitivity and wide dynamic range.
High receiver sensitivity is achieved by minimizing noise in
the transimpedance amplifier.
The signal current generated by a PIN diode can vary
between 0.25 µA to 1.6 mA (peak-to-peak value).
An AGC loop (see Fig.1) is implemented to make it
possible to handle such a wide dynamic range.
The AGC loop increases the dynamic range of the
receiver by reducing the feedback resistance of the
preamplifier. The AGC loop hold capacitor is integrated
on-chip, so an external capacitor is not needed for AGC.
The AGC voltage can be monitored at pad 15 on the naked
die (TZA3033U). Pad 15 is not bonded in the packaged
device (TZA3033T). This pad can be left unconnected
during normal operation. It can also be used to force an
external AGC voltage. If pad 15 (AGC) is connected to
VCC, the internal AGC loop is disabled and the receiver
gain is at a maximum. The maximum input current is then
about 10 µA.
A differential amplifier converts the output of the
preamplifier to a differential voltage. The data output circuit
is given in Fig.4.
The logic level symbol definitions are shown in Fig.5.
1998 Jul 08
5
5 Page 
Philips Semiconductors
SDH/SONET STM1/OC3 transimpedance amplifier
Objective specification
TZA3033
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Jul 08
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TZA3033.PDF ] | |
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