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부품번호 | TOCP100X-100MB 기능 |
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기능 | Optical Transmission Device | ||
제조업체 | Toshiba Semiconductor | ||
로고 | |||
TOSLINK Device Categories
TOSLINK devices can be classified as follows:
TOSLINK
Optical Modules
General-Purpose
Medium-Speed Data Transmission
Ceramic Package Modules
High-Speed Data Transmission
Digital Audio
Simplex (JIS F05)
Duplex (JIS F07)
Simplex (JIS F05)
Duplex (JIS F07)
Simplex (JIS F05)
Duplex (JIS F07,PN)
Duplex (SMI,PN)
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF
Simplex (JEITA RC-5720 square style) For APF
Fiber-Optic Connectors for Optical Fiber Cable
Simplex (F05)
Duplex (F07)
Connectors for Optical Fiber Cable
Simplex (F05)
Duplex (F07)
Optical Fiber Cables
Simplex
Duplex
Snap-in
Clip
Snap-in
Clip
Snap-in
Clip
Snap-in
Clip
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF/PCF
For APF
For APF/PCF
For APF/PCF
For APF/PCF
Adapters
Simplex (F05)
Duplex (F07)
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Note that the optical connectors (PN- and SMI-type) used for high-speed data
transmission are not TOSLINK products, Use fiber optic connectors and optical
fiber products from optical connector or optical fiber manufactures.
Notes: (1) The relevant JIS standards are referred to as follows:
F05: F05-type connector for optical fiber cables (JIS C 5974)
F07: F01-type connector for optical fiber cables (JIS C 5976)
4페이지 Ceramic-Package Modules
The TOSLINK product line includes several ceramic-package modules, which have higher reliability levels
than modules in molded-resin packages.
In these modules the LED, photodiode, transmission IC, receiving IC and chip capacitors are all mounted on a
ceramic substrate and hermetically sealed in metal shells.
These ceramic-package modules are used in applications requiring high levels of reliability.
Structure of a ceramic-package module (transceiving unit)
The optical transceiving units used in optical modules have the following
structure as shown in the figure on the right.
The LED, the transmitting IC which drives the LED and the chip capacitor
are mounted on a ceramic substrate.
In this particular unit the photodiode, the receiving IC (which features a
waveform-reshaping function) and the chip capacitors are also mounted on
the same ceramic substrate.
These devices are hermetically sealed in metal shells with glass windows.
Ceramic
substrate
Bonding
pad
Metal
shell
Transmission
IC
LED
Glass window
Capacitor
Photodetector
Receiving
IC
Lead
pin
Structure of ceramic-package
transceiver unit
Ceramic-package transceiving module (TODX283)
TODX283 – high-speed optical module compatible with PN-type connectors
The TODX283 is a ceramic-package transceiving module which can be used
with either an APF (all-plastic fiber) or a PCF (plastic-cladding silica-fiber)
cable.
Just like a general-purpose optical module, this product incorporates a
transmitting IC which drives an LED, and an on-chip receiving IC with a
waveform-reshaping function. It is easy to connect this module to peripheral
circuits, since its input and output are both TTL-level.
This module is compatible with PN-type connectors and JIS F7-type fiber-
optic connectors.
Main Specifications of the TODX283
Data rate: DC to 50 Mb/s (NRZ code)
Transmission distance: 10 m (max) (via APF cable)
100 m (max) (via PCF cable)
Pulse width distortion: less than ±7 ns
Center wavelength: 650nm
Operating temperature: –10°C to 70°C
TTL interface
External appearance of optical
tranceiving module TODX283
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7페이지 | |||
구 성 | 총 20 페이지수 | ||
다운로드 | [ TOCP100X-100MB.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
TOCP100X-100MB | Optical Transmission Device | Toshiba Semiconductor |
TOCP100X-100MB | Optical Transmission Device | Toshiba Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |