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Datasheet TOIM3000 Equivalent ( PDF )

N.º Número de pieza Descripción Fabricantes Category
1TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
2TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
3TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data


TOI Datasheet ( Hoja de datos ) - resultados coincidentes

N.º Número de pieza Descripción Fabricantes Catagory
1TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
2TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
3TOIM3000Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
4TOIM3232Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
5TOIM3232Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
6TOIM3232Infrared IrDA Integrated Interface Circuits

TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm) Description The TOIM3xxx series ICs provide proper timing for the front end infrared transceiver TFDS3
TEMIC Semiconductors
TEMIC Semiconductors
data
7TOIM3232Integrated Interface Circuits

TOIM3232 Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length (0.8 mm) Description The TOIM3232 IC provides proper pulse shaping for the front end infrared transceivers of the
Vishay Siliconix
Vishay Siliconix
data



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Número de pieza Descripción Fabricantes PDF
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