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PDF TP5510WM Data sheet ( Hoja de datos )
| Número de pieza | TP5510WM | |
| Descripción | Full Duplex Analog Front End for Consumer Applications | |
| Fabricantes | National Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TP5510WM (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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February 1997
TP5510
Full Duplex Analog Front End (AFE)
for Consumer Applications
General Description
The TP5510 consists of a m-law monolithic AFE device uti-
lizing the A D and D A conversion architecture shown in
Figure 1 and a serial data interface The device is fabricat-
ed using National’s advanced double-poly CMOS process
(microCMOS)
The A D portion of the device consists of an input gain
adjust amplifier an active RC pre-filter which eliminates very
high frequency noise and a switched-capacitor band-pass
filter that rejects signals below 200 Hz and above 3400 Hz
Also included are auto-zero circuitry and a compressing
A D which samples the filtered signal and converts it to the
m-law digital format The decode portion of the device con-
sists of an expanding D A which reconstructs the analog
signal from the compressed m-law code a low-pass filter
which corrects for the sin x x response of the D A output
and rejects signals above 3400 Hz followed by a single-
ended power amplifier capable of driving low impedance
loads The device requires a 1 536 MHz 1 544 MHz or
2 048 MHz master clock bit clocks which may vary from 64
kHz to 2 048 MHz and 8 kHz frame sync pulses
Features
Y Complete A D and D A with filter system including
Serial Data Interface
Encode high-pass and low-pass filter
Decode low-pass filter with sin x x correction
Active RC noise filters
m-law compatible A D and D A
Internal precision voltage reference
Internal auto-zero circuitry
Y m-law TP5510
Y g5V operation
Y Low operating power typically 60 mW
Y Power-down standby mode typically 3 mW
Y Automatic power-down
Y TTL or CMOS compatible digital interfaces
Y Maximizes PC card circuit density
Y Plastic DIP and SOIC packages
Y 8-bit digital I O
Y 13-bit dynamic range
Y Use with DSP processor
Y Applications Tapeless Answering Machines Cordless
Phones Cellular Radio
Connection Diagram
Dual-In-Line Package
Top View
Order Number TP5510WM
See NS Package Number M16B
Order Number TP5510N
See NS Package Number N16A
TL H 11186 – 1
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1996 National Semiconductor Corporation TL H 11186
RRD-B30M27 Printed in U S A
http www national com
1 page  
Absolute Maximum Ratings
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
VCC to GNDA
VBB to GNDA
Voltage at any Analog Input
or Output
7V
b7V
VCCa0 3V to VBBb0 3V
Voltage at any Digital Input or
Output
VCCa0 3V to GNDAb0 3V
Operating Temperature Range
b25 C to a 125 C
Storage Temperature Range
b65 C to a150 C
Lead Temperature (Soldering 10 seconds)
300 C
ESD (Human Body Model)
2000V
Latch-Up Immunity e 100 mA on any Pin
Electrical Characteristics Unless otherwise noted limits printed in BOLD characters are guaranteed for VCC
e 5 0V g5% VBB e b5 0V g5% TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C All other limits
are assured by correlation with other production tests and or product design and characterization All signals referenced to
GNDA Typicals specified at VCC e 5 0V VBB e b5 0V TA e 25 C
Symbol
Parameter
Conditions
Min Typ Max Units
DIGITAL INTERFACE
VIL
VIH
VOL
VOH
IIL
IIH
IOZ
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Input Low Current
Input High Current
Output Current in High Impedance
State (TRI-STATE)
DE ILe3 2 mA
SIGD ILe1 0 mA
TSE ILe3 2 mA Open Drain
DE IHeb3 2 mA
SIGD IHeb1 0 mA
GNDAsVINsVIL All Digital Inputs
VIHsVINsVCC
DE GNDAsVOsVCC
22
24
24
b10
b10
b10
06 V
V
04 V
04 V
04 V
V
V
10 mA
10 mA
10 mA
ANALOG INTERFACE WITH ENCODE INPUT AMPLIFIER (ALL DEVICES)
IIEA
RIEA
ROEA
RLEA
CLEA
VOEA
AVEA
FUEA
VOSEA
VCMEA
CMRREA
Input Leakage Current
Input Resistance
Output Resistance
Load Resistance
Load Capacitance
Output Dynamic Range
Voltage Gain
Unity Gain Bandwidth
Offset Voltage
Common-Mode Voltage
Common-Mode Rejection Ratio
b2 5VsVsa2 5V VFEIa or VFEIb b200
200
nA
b2 5VsVsa2 5V VFEIa or VFEIb
10
MX
Closed Loop Unity Gain
13
X
GSE
GSE
GSE RLt10 kX
VFEIa to GSE
10 kX
50 pF
b2 8
28 V
5000
VV
12
MHz
b20
20 mV
CMRREA l 60 dB
b2 5
25 V
DC Test
60 dB
PSRREA Power Supply Rejection Ratio
DC Test
60 dB
ANALOG INTERFACE WITH DECODE FILTER (ALL DEVICES)
RODF
Output Resistance
RLDF
Load Resistance
CLDF
Load Capacitance
VOSDO
Output DC Offset Voltage
POWER DISSIPATION (ALL DEVICES)
Pin VFDO
VFDOe g2 5V
13
X
600 X
500 pF
b200
200 mV
ICC0
IBB0
ICC1
IBB1
Power-Down Current
Power-Down Current
Power-Up Active Current
Power-Up Active Current
No Load (Note)
No Load (Note)
No Load
No Load
05 3
0 05 1
6 0 12
6 0 12
mA
mA
mA
mA
Note ICC0 and IBB0 are measured after first achieving a power-up state
5 http www national com
5 Page 
Applications Information
POWER SUPPLIES
While the pins of the AFE are well protected against electri-
cal misuse it is recommended but not mandatory that the
standard CMOS practice be followed ensuring that ground
is connected to the device before any other connections are
made In applications where the printed circuit board may be
plugged into a ‘‘hot’’ socket with power and clocks already
present an extra long ground pin in the connector should
be used
All ground connections to each device should meet at a
common point as close as possible to the GNDA pin This
minimizes the interaction of ground return currents flowing
through a common bus impedance 0 1 mF supply decou-
pling capacitors should be connected from this common
ground point to VCC and VBB as close to the device as
possible
For best performance if more than 1 AFE is on a card the
ground point of each AFE on a card should be connected to
a common card ground in star formation rather than via a
ground bus
This common ground point should be decoupled to VCC and
VBB with 10 mF capacitors
Physical Dimensions inches (millimeters) unless otherwise noted
Molded Small Outline Package (WM)
Order Number TP5510WM
NS Package Number M16B
11 http www national com
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TP5510WM.PDF ] | |
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