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부품번호 | TIPP115 기능 |
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기능 | PNP SILICON POWER DARLINGTONS | ||
제조업체 | Power Innovations Limited | ||
로고 | |||
전체 6 페이지수
Copyright © 1997, Power Innovations Limited, UK
q 20 W Pulsed Power Dissipation
q 100 V Capability
q 2 A Continuous Collector Current
q 4 A Peak Collector Current
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
LP PACKAGE
(TOP VIEW)
E
1
C2
3
B
MDTRAB
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0)
Emitter-base voltage
Continuous collector current
Peak collector current (see Note 1)
Continuous base current
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)
Pulsed power dissipation (see Note 3)
Operating junction temperature range
Storage temperature range
Lead temperature 3.2 mm from case for 10 seconds
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.
3. VCE = 20 V, IC = 1 A, PW = 10 ms, duty cycle ≤ 2%.
TIPP115
TIPP116
TIPP117
TIPP115
TIPP116
TIPP117
SYMBOL
VCBO
VCEO
VEBO
IC
ICM
IB
Ptot
PT
Tj
Tstg
TL
VALUE
-60
-80
-100
-60
-80
-100
-5
-2
-4
-50
0.8
20
-55 to +150
-55 to +150
260
UNIT
V
V
V
A
A
mA
W
W
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92) - Formed Leads Version
5,21
4,44
3,43 MIN.
2,67
2,03
LP003 Falls Within JEDEC
TO-226AA Dimensions
4,19
3,17
2,67
2,03
5,34
4,32
4,00 MAX.
0,56
0,40
123
2,90
2,40
2,90
2,40
0,41
0,35
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
4
MDXXAR
4페이지 | |||
구 성 | 총 6 페이지수 | ||
다운로드 | [ TIPP115.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
TIPP110 | NPN SILICON POWER DARLINGTONS | Power Innovations Limited |
TIPP111 | NPN SILICON POWER DARLINGTONS | Power Innovations Limited |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |