Datasheet.kr   

TE28F008C3B90 데이터시트 PDF




Intel Corporation에서 제조한 전자 부품 TE28F008C3B90은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 TE28F008C3B90 자료 제공

부품번호 TE28F008C3B90 기능
기능 3 VOLT ADVANCED+ BOOT BLOCK 8-/ 16-/ 32-MBIT FLASH MEMORY FAMILY
제조업체 Intel Corporation
로고 Intel Corporation 로고


TE28F008C3B90 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.



전체 30 페이지수

미리보기를 사용할 수 없습니다

TE28F008C3B90 데이터시트, 핀배열, 회로
E
PRODUCT PREVIEW
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
n Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
n High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
VPP = GND Option
VCC Lockout Voltage
n Low Power Consumption
9 mA Typical Read Power
10 µA Typical Standby Power with
Automatic Power Savings Feature
n Extended Temperature Operation
–40 °C to +85 °C
n Easy-12 V
Faster Production Programming
No Additional System Logic
n 128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
n Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
n Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
n Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
n SRAM-Compatible Write Interface
n Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
n x 16 for High Performance
48-Ball µBGA* Package
48-Lead TSOP Package
n x 8 I/O for Space Savings
48-Ball µBGA* Package
40-Lead TSOP Package
n 0.25 µ ETOX™ VI Flash Technology
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
May 1998
Order Number: 290645-001




TE28F008C3B90 pdf, 반도체, 판매, 대치품
3 VOLT ADVANCED+ BOOT BLOCK
APPENDIX D: Architecture Block Diagram ......52
APPENDIX E: Word-Wide Memory Map
Diagrams .....................................................53
APPENDIX F: Byte-Wide Memory Map
Diagrams .....................................................55
E
APPENDIX G: Device ID Table ..........................57
APPENDIX H: Protection Register
Addressing ..................................................58
Date of
Revision
05/12/98
Version
REVISION HISTORY
Description
-001 Original version
4 PRODUCT PREVIEW

4페이지










TE28F008C3B90 전자부품, 판매, 대치품
E
3 VOLT ADVANCED+ BOOT BLOCK
A16
A15
A14
A13
A12
A11
A9
A8
WE#
RP#
VPP
WP#
A18
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Advanced Boot
40-Lead TSOP
10 mm x 20 mm
TOP VIEW
40 A17
39 GND
38 A20 16M
37 A19 8M
36 A10
35 DQ7
34 DQ6
33 DQ5
32 DQ4
31 VCCQ
30 VCC
29 NC
28 DQ3
27 DQ2
26 DQ1
25 DQ0
24 OE#
23 GND
22 CE#
21 A0
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pin 38.
Figure 1. 40-Lead TSOP Package for x8 Configurations
32M
16M
8M
A15
A14
A13
A12
A11
A10
A9
A8
A20
NC
WE#
RP#
V PP
WP#
A19
A 18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
48 A16
47 VCCQ
46 GND
45 DQ15
44 DQ7
43 DQ14
42 DQ6
41 DQ13
40 DQ5
39 DQ12
38 DQ4
37 V CC
36 DQ11
35 DQ3
34 DQ10
33 DQ2
32 DQ9
31 DQ1
30 DQ8
29 DQ0
28 OE#
27 GND
26 CE#
25 A0
NOTE:
Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pins 9 and 15.
Figure 2. 48-Lead TSOP Package for x16 Configurations
PRODUCT PREVIEW
7

7페이지


구       성 총 30 페이지수
다운로드[ TE28F008C3B90.PDF 데이터시트 ]

당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는

포괄적인 데이터시트를 제공합니다.


구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한
광범위한 전력 반도체를 판매합니다.

전력 반도체 전문업체

상호 : 아이지 인터내셔날

사이트 방문 :     [ 홈페이지 ]     [ 블로그 1 ]     [ 블로그 2 ]



관련 데이터시트

부품번호상세설명 및 기능제조사
TE28F008C3B90

3 VOLT ADVANCED+ BOOT BLOCK 8-/ 16-/ 32-MBIT FLASH MEMORY FAMILY

Intel Corporation
Intel Corporation

DataSheet.kr       |      2020   |     연락처      |     링크모음      |      검색     |      사이트맵