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부품번호 TE28F160B3B150 기능
기능 SMART 3 ADVANCED BOOT BLOCK WORD-WIDE
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TE28F160B3B150 데이터시트, 핀배열, 회로
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
WORD-WIDE
4-MBIT (256K X 16), 8-MBIT (512K X 16),
16-MBIT (1024K X 16)
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3
n Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V VPP Fast Production
Programming
n 2.7V or 1.8V I/O Option
Reduces Overall System Power
n Optimized Block Sizes
Eight 4-KW Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 32-KW Blocks for
Code
n High Performance
2.7V–3.6V: 120 ns Max Access Time
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
20 mA Maximum Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40°C to +85°C
n Supports Code Plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Extended Cycling Capability
10,000 Block Erase Cycles
n Automated Word Program and Block
Erase
Command User Interface
Status Registers
n SRAM-Compatible Write Interface
n Automatic Power Savings Feature
n Reset/Deep Power-Down
1 µA ICCTypical
Spurious Write Lockout
n Standard Surface Mount Packaging
48-Ball µBGA* Package
48-Lead TSOP Package
n Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
n ETOX™ V (0.4 µ) Flash Technology
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide
products will be available in 48-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp.
May 1997
Order Number: 290580-002




TE28F160B3B150 pdf, 반도체, 판매, 대치품
SMART 3 ADVANCED BOOT BLOCK–WORD-WIDE
E
Number
-001
-002
REVISION HISTORY
Description
Original version
Section 3.4, VPP Program and Erase Voltages, added
Updated Figure 9: Automated Block Erase Flowchart
Updated Figure 10: Erase Suspend/Resume Flowchart (added program op. to table)
Updated Figure 16: AC Waveform: Program and Erase Operations (updated notes)
IPPR maximum specification change from ±25 µA to ±50 µA
Program and Erase Suspend Latency specification change
Updated Appendix A: Ordering Information (included 8M and 4M information)
Updated Figure, Appendix D: Architecture Block Diagram (Block info. in Words not
bytes)
Minor wording changes
4 PRELIMINARY

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TE28F160B3B150 전자부품, 판매, 대치품
E
SMART 3 ADVANCED BOOT BLOCK–WORD-WIDE
2.1 Package Pinouts
The Smart 3 Advanced Boot Block flash memory is
available in 48-lead TSOP (see Figure 1) and 48-
ball µBGA packages (see Figures 2-4). In Figure 1,
pin changes from one density to the next are
circled. Both packages, 48-lead TSOP and 48-ball
µBGA* package, are 16-bits wide and fully
upgradeable across product densities (from 4 Mb to
16 Mb).
28F400B3 28F800B3
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RP#
V PP
WP#
NC
NC
A17
A7
A6
A5
A4
A3
A2
A1
A 15
A 14
A 13
A12
A11
A 10
A9
A8
NC
NC
WE#
RP#
V PP
WP#
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A 15
A 14
A 13
A12
A11
A 10
A9
A8
NC
NC
WE#
RP#
V PP
WP#
A 19
A 18
A 17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
16-Mbit
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Figure 1. 48-Lead TSOP Package
28F800B3 28F400B3
A16
VCCQ
GND
DQ15
DQ 7
DQ 14
DQ 6
DQ 13
DQ 5
DQ 12
DQ 4
V CC
DQ 11
DQ 3
DQ 10
DQ 2
DQ 9
DQ 1
DQ 8
DQ 0
OE#
GND
CE#
A0
A 16
VCCQ
GND
DQ15
DQ 7
DQ 14
DQ 6
DQ 13
DQ 5
DQ 12
DQ 4
V CC
DQ 11
DQ 3
DQ 10
DQ 2
DQ 9
DQ 1
DQ 8
DQ 0
OE#
GND
CE#
A0
A16
VCCQ
GND
DQ15
DQ 7
DQ 14
DQ 6
DQ 13
DQ 5
DQ 12
DQ 4
V CC
DQ 11
DQ 3
DQ 10
DQ 2
DQ 9
DQ 1
DQ 8
DQ 0
OE#
GND
CE#
A0
0580_01
PRELIMINARY
7

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TE28F160B3B150

SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

Intel Corporation
Intel Corporation

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