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PDF TEA1081T Data sheet ( Hoja de datos )
| Número de pieza | TEA1081T | |
| Descripción | Supply circuit with power-down for telephone set peripherals | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TEA1081
Supply circuit with power-down for
telephone set peripherals
Product specification
Supersedes data of February 1988
File under Integrated Circuits, IC03
September 1994
Philips Semiconductors
1 page  
Philips Semiconductors
Supply circuit with power-down for
telephone set peripherals
Product specification
TEA1081
handbook, h6alfpage
VO
(V)
4
2
(1)
(2)
(3)
MLC169
RV = 100 kΩ
75 kΩ
50 kΩ
Input current at VLN(rms) = 1 V and without RV
approximates to:
I1 = IINT + 2 × IO (mA)
The maximum supply current (within the specified output
current limits) available for peripheral devices is shown by:
IOmax = I--L---I--N---E----m----i-n----–-----I-2-L---N---m----i--n----–----I--I--N---T-
Where:
ILINEmin is the minimum line current of the telephone set;
ILNmin is the specified minimum input current of the
speech/transmission circuit.
0
0 2 4 6 8 10
VLN (V)
RV connected between QS and VA.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.
Fig.4 Output voltage as a function of line voltage.
Input low-pass filter: IF (pin 5)
The input impedance between LN and VN at audio
frequencies is determined by the filter elements CL
(between pins 1 and 5), RL (between pins 5 and 7) and the
internal resistor RS (typical value 20 Ω).
At audio frequencies the TEA1081 behaves as an inductor
of the value LI = CL × RL × RS (H). The typical value of LI at
CL = 2.2 µF and RL = 100 kΩ is 4.4 H.
Input and output currents I1 and IO (pins 1 and 7)
The maximum available current into pin 1 (I1) is
determined by:
• The minimum line current (ILINEmin) that is available for
the telephone set
• The specified minimum input current (ILNmin) for the
speech/transmission circuit.
That is I1max = ILINEmin − ILNmin.
At VLN(rms) < 150 mV, the input current I1 is approximately:
I1 = IINT + k × IO (mA)
Where:
IINT = internal supply current (0.8 mA at VLN = 4 V);
k = correction factor (k < 1.1 for the specified output
current range).
With large line signals the instantaneous line voltage may
drop below VO + 0.4 V. Normally (when VLN > VO + 0.4 V),
instantaneous current flows from LN to QS (pin 1 to pin 7)
to the output load.
When VLN < VO + 0.4 V, the instantaneous current is
diverted to pin 2 to prevent distortion of the line signal.
Amplifier decoupling: AD (pin 3)
To ensure stability, a 68 pF decoupling capacitor is
required between AD (pin 3) and LN (pin 1).
If IOmin < 1.5 mA, a 47 pF capacitor has to be added
between AD (pin 3) and VA (pin 6).
Power-down inputs: PD and SP (pins 4 and 8)
During pulse dialling or register recall, or if the input current
to pin 1 is insufficient to maintain the output current, the
supply to peripheral devices can be switched off by
activating the PD input at pin 4. With PD = HIGH, the input
current is reduced to 40 µA (typ.) at VLN = 4 V and the
internal circuits are isolated from the load at QS (pin 7).
The power-down circuit is supplied via the SP input (pin 8).
SP can be wired to QS in conditions where VO > VSPmin
during line interruptions. When VO < VSPmin, SP should be
wired to an external supply point (e.g. to VCC of the
TEA1060 family circuit).
When power-down is not required, the PD and SP inputs
can be left open-circuit.
September 1994
5
5 Page 
Philips Semiconductors
Supply circuit with power-down for
telephone set peripherals
Product specification
TEA1081
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low-voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
Plastic small-outline packages
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
September 1994
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TEA1081T.PDF ] | |
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