PDF TH50VSF3681AASB Data sheet ( Hoja de datos )

Número de pieza	TH50VSF3681AASB
Descripción	SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
Fabricantes	Toshiba Semiconductor
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No Preview Available ! TH50VSF3680/3681AASB TENTATIVE TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VSF3680/3681AASB is a mixed multi-chip package containing a 8,388,608-bit Full CMOS SRAM and a 67,108,864-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration. The power supply. FLASH MEMORY a Simultaneous Read/Write operation so that data can be read during a Write or Erase operation. The TH50VSF3680/3681AASB can range from 2.7 V to 3.3 V. The TH50VSF3680/3681AASB is available in a 69-pin BGA package, making it suitable for a variety of design applications. FEATURES • Power supply voltage VCCs = 2.7 V~3.3 V VCCf = 2.7 V~3.3 V • Data retention supply voltage VCCs = 1.5 V~3.3 V • Current consumption Operating: 45 mA maximum (CMOS level) Standby: 10 µA maximum (SRAM CMOS level) Standby: 10 µA maximum (FLASH) • Block erase architecture for flash memory 8 × 8 Kbytes 63 × 64 Kbytes • Organization CIOF CIOS Flash Memory SRAM VCC VCC VSS VCC VSS VSS 4,194,304 words of 16 bits 4,194,304 words of 16 bits 8,388,608 words of 8 bits 524,288 words of 16 bits 1,048,576 words of 8 bits 1,048,576 words of 8 bits • Function mode control for flash memory Compatible with JEDEC-standard commands • Flash memory functions Simultaneous Read/Write operations Auto-Program Auto Chip Erase, Auto Block Erase Auto Multiple-Block Erase Program Suspend/Resume Block-Erase Suspend/Resume Data Polling/Toggle Bit function Block Protection/Boot Block Protection Automatic Sleep, Hidden ROM Area Supports Common Flash Memory Interface (CFI) Byte/Word Mode • Erase and Program cycle for flash memory 105 cycles (typical) • Boot block architecture for flash memory TH50VSF3680AASB: Top boot block TH50VSF3681AASB: Bottom boot block • Package P-FBGA69-1209-0.80A3: 0.31 g (typ.) PIN ASSIGNMENT (TOP VIEW) PIN NAMES • Case: CIOF = VCC, CIOS = VCC (×16, ×16) 1 2 3 4 5 6 7 8 9 10 A NC NC B NC NC C NC A7 LB WP/ACC WE A8 A11 D A3 A6 UB RESET CE2S A19 A12 A15 E A2 A5 A18 RY/BY A20 A9 A13 A21 F NC A1 A4 A17 A10 A14 NC NC G NC A0 VSS DQ1 H CEF OE DQ9 DQ3 DQ6 DU A16 DQ4 DQ13 DQ15 CIOF NC J CE1S DQ0 DQ10 VCCf VCCs DQ12 DQ7 VSS K DQ8 DQ2 DQ11 CIOS DQ5 DQ14 L NC NC M NC NC A0~A22 Address Inputs A12S A12 Input for SRAM A12F A12 Input for Flash Memory SA A19 Input for SRAM DQ0~DQ15 Data Inputs/Outputs CE1S , CE2S Chip Enable Inputs for SRAM CEF Chip Enable Input for Flash Memory OE Output Enable Input WE Write Enable Input LB , UB Data Byte Control Input RY/BY Ready/Busy Output RESET Hardware Reset Input WP/ACC Write Protect/Program Acceleration Input CIOS Word Enable Input for SRAM CIOF Word Enable Input for Flash Memory VCCs VCCf VSS NC Power Supply for SRAM Power Supply for Flash Memory Ground Not Connected DU Don’t Use 000707EBA2 • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 2001-03-06 1/55 1 page TH50VSF3680/3681AASB COMMAND SEQUENCES COMMAND SEQUENCE BUS WRITE CYCLES REQ’D FIRST BUS WRITE CYCLE Addr. Data SECOND BUS WRITE CYCLE Addr. Data THIRD BUS WRITE CYCLE Addr. Data FOURTH BUS WRITE CYCLE Addr. Data FIFTH BUS SIXTH BUS WRITE CYCLE WRITE CYCLE Addr. Data Addr. Data Read/Reset 1 XXXH F0H Read/Reset ID Read Word Byte Word Byte 3 3 555H AAAH AAH 2AAH 555H 555H AAAH AAH 2AAH 555H 555H 55H F0H AAAH BK(3) + 555H 55H BK(3) + 90H AAAH (1) RA (4) IA (2) RD (5) ID Word Auto-Program Byte Program Suspend Program Resume 4 1 1 555H 2AAH AAH 55H 555H A0H (6) PA AAAH 555H AAAH BK(3) B0H BK(3) 30H (7) PD Auto Chip Erase Word Byte 6 555H 2AAH 555H 555H AAH 55H 80H AAAH 555H AAAH AAAH AAH 2AAH 555H 55H 10H 555H AAAH Auto Block Erase Word Byte Block Erase Suspend Block Erase Resume Block Protect Verify Block Protect Word Byte 6 1 1 4 3 555H 2AAH 555H 555H AAH 55H 80H AAAH 555H AAAH AAAH AAH 2AAH (8) 55H BA 30H 555H BK(3) B0H BK(3) 30H XXXH 60H BPA(9) 60H XXXH 40H BPA(9) BPD(10) 555H AAAH AAH 2AAH 555H BK(3) + 555H (9) (10) 55H BK(3) + 90H BPA BPD AAAH Fast Program Set Word Byte Fast Program Fast Program Reset 3 2 2 555H AAAH XXXH XXXH AAH A0H 90H 2AAH 555H PA(6) XXXH 55H PD(7) F0H(13) 555H AAAH 20H Hidden ROM Mode Entry Word Byte 3 555H 2AAH 555H AAH 55H 88H AAAH 555H AAAH Hidden ROM Program Word Byte 4 555H 2AAH AAH 55H 555H A0H (6) PA AAAH 555H AAAH (7) PD Hidden ROM Erase Word Byte 6 555H 2AAH 555H 555H AAH 55H 80H AAAH 555H AAAH AAAH AAH 2AAH (8) 55H BA 30H 555H Hidden ROM Mode Exit Word Byte 4 555H 2AAH 555H AAH 55H 90H XXXH AAAH 555H AAAH Query Command BK(3) + Word 55H (11) (12) 2 BK(3) + 98H CA CD Byte AAH 00H Note: The system should generate the following address patterns: • Byte mode when VIL is inputted to CIOF, and addresses Word Mode: 555H or 2AAH to addresses A10~A0 are A22~A0 Byte Mode: AAAH or 555H to addresses A10~A0, A12F • Write mode when VIH is inputted to CIOF, and addresses DQ8~DQ15 are ignored in Word mode. are A21~A0 • Valid addresses are A10~A0 when a command is entered. (1) RA: Read Address (6) PA: Program Address (2) RD: Read Data (7) PD: Program Data (3) BK: Bank Address = A21~A15 (8) BA: Block Address = A21~A12 (4) IA: Bank Address and ID Read Address (A6, A1, A0) (9) BPA: Block Address and ID Read Address (A6, A1, A0) Bank Address = A21~A15 Manufacturer Code = (0, 0, 0) Device Code = (0, 0, 1) Block Address = A21~A12 ID Read Address = (0, 1, 0) (5) ID: ID Data (10) BPD: Verify Data 0098H - Manufacturer Code (11) CA: CFI Address 0093H - Device Code (TH50VSF3680AASB) (12) CD: CFI Data 0095H - Device Code (TH50VSF3681AASB) (13) F0H: 00H is valid too 0001H - Protected Block 2001-03-06 5/55 5 Page TH50VSF3680/3681AASB (2) TH50VSF3681AASB (bottom boot block) BANK # BLOCK # BLOCK ADDRESS BANK ADDRESS A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 ADDRESS RANGE BYTE MODE WORD MODE BA0 L L L L L L L L L L 000000H~001FFFH 000000H~000FFFH BA1 L L L L L L L L L H 002000H~003FFFH 001000H~001FFFH BA2 L L L L L L L L H L 004000H~005FFFH 002000H~002FFFH BA3 L L L L L L L L H H 006000H~007FFFH 003000H~003FFFH BK0 BA4 L L L L L L L H L L 008000H~009FFFH 004000H~004FFFH BA5 L L L L L L L H L H 00A000H~00BFFFH 005000H~005FFFH BA6 L L L L L L L H H L 00C000H~00DFFFH 006000H~006FFFH BA7 L L L L L L L H H H 00E000H~00FFFFH 007000H~007FFFH BA8 L L L L L L H * * * 010000H~01FFFFH 008000H~00FFFFH BA9 L L L L L H L * * * 020000H~02FFFFH 010000H~017FFFH BA10 L L L L L H H * * * 030000H~03FFFFH 018000H~01FFFFH BK1 BA11 L L L L H L L * * * 040000H~04FFFFH 020000H~027FFFH BA12 L L L L H L H * * * 050000H~05FFFFH 028000H~02FFFFH BA13 L L L L H H L * * * 060000H~06FFFFH 030000H~037FFFH BA14 L L L L H H H * * * 070000H~07FFFFH 038000H~03FFFFH BA15 L L L H L L L * * * 080000H~08FFFFH 040000H~047FFFH BA16 L L L H L L H * * * 090000H~09FFFFH 048000H~04FFFFH BA17 L L L H L H L * * * 0A0000H~0AFFFFH 050000H~057FFFH BA18 L L L H L H H * * * 0B0000H~0BFFFFH 058000H~05FFFFH BK2 BA19 L L L H H L L * * * 0C0000H~0CFFFFH 060000H~067FFFH BA20 L L L H H L H * * * 0D0000H~0DFFFFH 068000H~06FFFFH BA21 L L L H H H L * * * 0E0000H~0EFFFFH 070000H~077FFFH BA22 L L L H H H H * * * 0F0000H~0FFFFFH 078000H~07FFFFH BA23 L L H L L L L * * * 100000H~10FFFFH 080000H~087FFFH BA24 L L H L L L H * * * 110000H~11FFFFH 088000H~08FFFFH BA25 L L H L L H L * * * 120000H~12FFFFH 090000H~097FFFH BA26 L L H L L H H * * * 130000H~13FFFFH 098000H~09FFFFH BK3 BA27 L L H L H L L * * * 140000H~14FFFFH 0A0000H~0A7FFFH BA28 L L H L H L H * * * 150000H~15FFFFH 0A8000H~0AFFFFH BA29 L L H L H H L * * * 160000H~16FFFFH 0B0000H~0B7FFFH BA30 L L H L H H H * * * 170000H~17FFFFH 0B8000H~0BFFFFH (Continued) 2001-03-06 11/55 11 Page

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