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IDT77901D 데이터시트 PDF




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부품번호 IDT77901D 기능
기능 NICStAR Evaluation Board for IDT77201 PCI Segmentation and Reassembly Controller
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IDT77901D 데이터시트, 핀배열, 회로
®
Integrated Device Technology, Inc.
NICStAR Evaluation Board ADVANCE INFORMATION
for IDT77201 PCI Segmentation and
IDT77901C/D
Reassembly Controller
FEATURES:
• Complete 155Mbps PCI-bus ATM Network Interface
Card
• Complete reference design including schematics, bill of
materials, and theory of operation
• Connectors for logic analyzers and oscilloscopes
• Supports 33MHz, 32-bit PCI 2.0 bus
• 155Mbps Multimode fiber optical interface
• Complete reference design including schematics, bill of
materials, and data bases needed for production.
• Capable of supporting up to 16K receive connections
• Supports tens of thousands of transmit connections
• E2 PROM layout for Sub-vendor ID
• "SARWIN" software evaluation program available for
Windows 3.1™
• Third Party Software available:
- Telogy Networks
Windows NT™ Drivers and other Windows Drivers
21 Firstfield Road, Gaithersburg, Maryland 20878
(301) 527-2788 (phone) (301) 417-0324 (FAX)
- Harris & Jefferies
Novel Netware™ Drivers
888 Washington Street, Dedham,
Massachusetts, 02026
(617) 329-3200 (phone) (617) 329-4148 (FAX)
chrisb@hjinc,com
- Advancenet Systems Inc.
Windows NT™ and Windows 95™ Drivers
406 Timbermill Rd., Durham, North Carolina 27713
(919) 544-5601 (phone) (919) 544-4601 (FAX)
DESCRIPTION:
The IDT77901 is designed to provide a stable reference
platform for evaluation, design, and test of IDT's 77201
Segmentation and Reassembly controller. The IDT77901
provides a fiber media physical (PHY) interface. The IDT77901
features complete PCI-bus ATM NIC functionality, plugging
directly into PCI bus expansion slots.Test points, including
sockets for logic analyzer and oscilloscope probes are pro-
vided on all buses. These connectors may be used for simple
FUNCTIONAL BLOCK DIAGRAM
19MHz
OSC
32K 32K 32K 32K
x8 x8 x8 x8
SRAM SRAM SRAM SRAM
EPROM
ODL
IDT77201
NICStAR
SAR
50MHz
OSC
COMMERCIAL TEMPERATURE RANGE
©1996 Integrated Device Technology, Inc.
8.09
E2
PROM
JANUARY 1997
1




IDT77901D pdf, 반도체, 판매, 대치품
IDT77901C/D
NICStAR Evaluation Board
ADVANCED INFORMATION
Commercial Temperature Range
Hewlett-Packard HFBR-5103, which is a short-haul device for
multimode fiber, originally designed for FDDI. Other devices
in the HFBR-510x and -520x families should also work here,
depending on the application. An extra row of 7 ground pins
is provided next to the U9 pins to provide ground points for
oscilloscope probes.
Note that compatibility with the physical layer of the 51.84
Mbps ATM spec is not provided by design in this board. This
spec requires Category 3 UTP cable and a different physical
media interface than the fiber interface on this board. How-
ever, the 77901 does allow the 77155 to support the 51.84
Mbps rate by using different components for the transmit/
receive clock oscillator and loop filter, and this allows the
77901 to be used to test the SAR’s own support for the 51.84
Mbps rate. Interoperability with other 51.84 Mbps ATM de-
vices using the correct physical media interface is possible but
not guaranteed.
The 77901/2 provides many test points for Hewlett-Packard
logic analyzer termination adapters and two-pin analog oscil-
loscope probes such as those used on the Tektronix TLS-216
oscilloscope. J3-J8 are 20-pin headers in the configuration
required by the HP termination adapters, and TP1-TP14 are
two-pin headers where pin 1 is the signal and pin 2 is ground.
The pins of U9 can also be used as oscilloscope test points as
described above.
Two SOIC footprints, U18 and U19, for either 0.15” or 0.3”
body width devices are provided as spare IC positions; the
PHY_CLK synchronization circuit normally occupies U19.
U16 is a spare footprint for a PLCC-28 package, such as a
22V10 GAL. A large through-hole prototyping area is provided
at the right end of the fab. All of the through-holes on the top,
right, and bottom edges of this area are bussed together on
the bottom of the board and connected to the internal ground
plane, which is also connected to the ground plane on the rest
of the board. The through-holes just inside the grounded
through-holes are also bussed together, on the top side of the
board, and connected to the internal power plane. However,
the power plane under the prototyping area is NOT internally
connected to the power plane on the rest of the board, and
must be connected externally if required. This allows the PC
board to be cut in half along the dotted line on the bottom side
of the board without risk of the exposed edges of the power
and ground planes shorting together.
Other special features-- the EPROM, EEPROM, oscillator,
and ODL through-hole devices may all be socketed. The
oscillators may have the “8-pin” half-size or the “14-pin” full-
size footprint, and a special ground plane is provided on the
top side of the board to minimize radiated EMI. The ODL
socket must have flush-mount socket pins for mechanical
reasons. Through-hole size was specified for the Mill-Max
0552-2-15-01-11-14-10-0 socket pin, though other socket
pins will work here. The pads for the NICStAR, U13, were
designed to work with the AMP 824160-1 QFP-208 socket,
which allows a CQFP-208 or PQFP-208 device to be socketed
into a QFP-208 footprint (this eliminates the need for a
redundant PGA footprint, as other QFP-208 sockets require).
8.09 4

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