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PDF BTB16 Data sheet ( Hoja de datos )
| Número de pieza | BTB16 | |
| Descripción | 16A TRIACS | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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BTA16, BTB16
T1610, T1635
16 A Snubberless™, logic level and standard Triacs
Features
■ Medium current Triac
■ Low thermal resistance with clip bonding
■ Low thermal resistance insulation ceramic for
insulated BTA
■ High commutation (4Q) or very high
commutation (3Q) capability
■ BTA series UL1557 certified (File ref: 81734)
■ RoHS ( 2002/95/EC) compliant
■ Insulated tab (BTA series, rated at 2500 VRMS)
Applications
■ Snubberless versions (BTA/BTB...W and
T1635) especially recommended for use on
inductive loads, because of their high
commutation performances
■ On/off or phase angle function in applications
such as static relays, light dimmers and
appliance motor speed controllers
A2
G
A1
A2
A1 A2
G
D2PAK
T1610G
T1635G
A2
A1
A2
G
TO-220AB
insulated
BTA16
A1
A2
G
TO-220AB
BTB16
Description
Available either in through-hole or surface-mount
packages, the BTA16, BTB16, T1610 and T1635
Triacs series are suitable for general purpose
mains power AC switching.
Table 1. Device summary
Symbol
Parameter
BTA16 (1)
IT(RMS)
On-state rms current
VDRM/VRRM Repetitive peak off-state voltage
IGT (Snubberless) Triggering gate current
IGT (logic level) Triggering gate current
IGT (standard) Triggering gate current
1. Insulated
16
600/800
35/50
10
25/50
TM: Snubberless is a trademark of STMicroelectronics
BTB16
16
600/800
35/50
10
25/50
T1610
16
600/800
-
10
-
T1635
16
600/800
35
-
-
March 2010
Doc ID 7471 Rev 9
1/10
www.st.com
10
1 page  
BTA16, BTB16, T1610, T1635
Characteristics
Figure 7. Non-repetitive surge peak on-state Figure 8. Relative variation of gate trigger
current for a sinusoidal
current
ITSM(A), I2t (A2s)
3000
dI/dt limitation:
50A/µs
1000
Tj initial=25°C
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
holding current and latching current versus junction
temperature (typical values)
2.0
IGT
ITSM 1.5
IH & IL
1.0
I2t 0.5
100 pulse with width tp < 10 ms and corresponding value of I2t tp(ms)
0.0
Tj(°C)
0.01
0.10
1.00
10.00
-40 -20 0 20 40 60 80 100 120 140
Figure 9.
Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus
decrease of main current versus
(dV/dt)c (typical values)
(dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
Snubberless and Logic level types
1.8 SW
1.6 C
B
1.4
1.2 T1635/CW/BW
1.0
0.8
0.6
0.4
0.1
(dV/dt)c (V/µs)
1.0 10.0
100.0
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6
5
4
3
2
1
Tj(°C)
0
0 25 50 75
Standard types
100 125
Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab
(printed circuit board FR4, copper thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
60
50
D2PAK
40
30
20
10
S(cm²)
0
0 4 8 12 16 20 24 28 32 36 40
Doc ID 7471 Rev 9
5/10
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet BTB16.PDF ] | |
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