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PDF BTW67 Data sheet ( Hoja de datos )
| Número de pieza | BTW67 | |
| Descripción | 50A SCRs | |
| Fabricantes | ST Microelectronics | |
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® BTW67 and BTW69 Series
STANDARD
50A SCRS
Table 1: Main Features
Symbol
Value
IT(RMS)
50
VDRM/VRRM
600 to 1200
IGT 80
Unit
A
V
mA
DESCRIPTION
Available in high power packages, the BTW67 /
BTW69 Series is suitable in applications where
power handling and power dissipation are critical,
such as solid state relays, welding equipment,
high power motor control.
Based on a clip assembly technology, they offer a
superior performance in surge current handling
capabilities.
Thanks to their internal ceramic pad, they provide
high voltage insulation (2500VRMS), complying
with UL standards (file ref: E81734).
A
G
K
K
G
A
RD91
(BTW67)
K
A
G
TOP3 Ins.
(BTW69)
Table 2: Order Codes
Part Numbers
BTW67-xxx
BTW69-xxxRG
Marking
BTW67xxx
BTW69xxx
Table 3: Absolute Ratings (limiting values)
Symbol
IT(RMS)
RMS on-state current
(180° conduction angle)
Parameter
RD91
TOP3 Ins.
IT(AV)
ITSM
I²t
dI/dt
IGM
PG(AV)
Tstg
Tj
VRGM
Average on-state current
(180° conduction angle)
RD91
TOP3 Ins.
tp = 8.3 ms
Non repetitive surge peak on-state current
tp = 10 ms
I²t Value for fusing
Critical rate of rise of on-state current IG = 2
x IGT , tr ≤ 100 ns
F = 60 Hz
Peak gate current
tp = 20 µs
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Maximum peak reverse gate voltage
Tc = 70°C
Tc = 75°C
Tc = 70°C
Tc = 75°C
Tj = 25°C
Tj = 25°C
Value
50
32
610
580
1680
Tj = 125°C
50
Tj = 125°C
Tj = 125°C
8
1
- 40 to + 150
- 40 to + 125
5
Unit
A
A
A
A2S
A/µs
A
W
°C
V
February 2006
REV. 5
1/6
1 page  
BTW67 and BTW69 Series
Figure 10: TOP3 Insulated Package Mechanical Data
H
R ØL
K
FG
P
JJ
C
A
B
D
E
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 4.4
4.6 0.173
0.181
B 1.45
1.55 0.057
0.061
C 14.35
15.60 0.565
0.614
D 0.5
0.7 0.020
0.028
E 2.7
2.9 0.106
0.114
F 15.8
16.5 0.622
0.650
G 20.4
21.1 0.815
0.831
H 15.1
15.5 0.594
0.610
J 5.4
5.65 0.213
0.222
K 3.4
3.65 0.134
0.144
ØL 4.08
4.17 0.161
0.164
P 1.20
1.40 0.047
0.055
R 4.60
0.181
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 7: Ordering Information
Ordering type
Marking
BTW67-xxx
BTW67xxx
BTW69-xxxRG
BTW69xxx
Note: xxx = voltage
Package
RD91
TOP3 Ins.
Weight
20 g
4.5 g
Base qty Delivery mode
25 Bulk
30 Tube
Table 8: Revision History
Date
Apr-2001
Revision
4A
13-Feb-2006
5
Description of Changes
Last update.
TOP3 Insulated delivery mode changed from bulk to tube.
ECOPACK statement added.
5/6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet BTW67.PDF ] | |
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