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PDF BU1706AB Data sheet ( Hoja de datos )

Número de pieza BU1706AB
Descripción Silicon Diffused Power Transistor
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BU1706AB
GENERAL DESCRIPTION
High-voltage, high-speed switching npn transistor in a plastic envelope suitable for surface mounting, intended for
use in high frequency electronic lighting ballast applications.
QUICK REFERENCE DATA
SYMBOL
VCESM
VCEO
IC
ICM
Ptot
VCEsat
ICsat
tf
PARAMETER
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Collector saturation current
Fall time
CONDITIONS
VBE = 0 V
Tmb 25 ˚C
IC = 1.5 A; IB = 0.3 A
ICM = 1.5 A; IB(on) = 0.3 A
TYP.
-
-
-
-
-
-
1.5
0.25
MAX.
1750
850
5
8
100
1.0
-
0.6
UNIT
V
V
A
A
W
V
A
µs
PINNING - SOT404
PIN DESCRIPTION
1 base
2 collector
3 emitter
mb collector
PIN CONFIGURATION
mb
2
13
SYMBOL
c
b
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VCESM
VCEO
IC
ICM
IB
IBM
-IB(AV)
-IBM
Ptot
Tstg
Tj
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Reverse base current
Reverse base current peak value
Total power dissipation
Storage temperature
Junction temperature
VBE = 0 V
average over any 20ms period
Tmb 25 ˚C
THERMAL RESISTANCES
SYMBOL
Rth j-mb
Rth j-a
PARAMETER
Thermal resistance junction to mounting
base
Thermal resistance junction to ambient
CONDITIONS
minimum footprint, FR4 board
MIN.
-
-
-
-
-
-
-
-
-
-65
-
MAX.
1750
850
5
8
3
5
100
4
100
150
150
UNIT
V
V
A
A
A
A
mA
A
W
˚C
˚C
TYP. MAX. UNIT
- 1.25 K/W
55 - K/W
February 1998
1
Rev 1.000

1 page




BU1706AB pdf
Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BU1706AB
IC / A
10 ICM
I CDC
1 Ptot
tp =
0.1 100 us
1 ms
10 ms
DC
0.01
1
10 VCE / V 100
1000
Fig.15. Forward bias safe operating area. Tmb = 25 ˚C
I Region of permissible DC operation.
II Extension for repetitive pulse operation.
NB: Mounted with heatsink compound and
30 ± 5 newton force on the centre of the
envelope.
IC / A
6
BU1706A
5
4
3
2
1
0
0
400
800
1200
VCE / V
1600
2000
Fig.16. Reverse bias safe operating area. Tj Tjmax
February 1998
5
Rev 1.000

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